Note: (1) EPF" />
參數(shù)資料
型號: EPF10K130EFC484-2X
廠商: Altera
文件頁數(shù): 6/100頁
文件大?。?/td> 0K
描述: IC FLEX 10KE FPGA 130K 484-FBGA
產(chǎn)品培訓模塊: Three Reasons to Use FPGA's in Industrial Designs
標準包裝: 60
系列: FLEX-10KE®
LAB/CLB數(shù): 832
邏輯元件/單元數(shù): 6656
RAM 位總計: 65536
輸入/輸出數(shù): 369
門數(shù): 342000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 484-BGA
供應商設備封裝: 484-FBGA(23x23)
其它名稱: EPF10K130EFC4842X
Altera Corporation
13
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Figure 4. FLEX 10KE Device in Single-Port RAM Mode
Note:
(1)
EPF10K30E, EPF10K50E, and EPF10K50S devices have 88 EAB local interconnect channels; EPF10K100E,
EPF10K130E, EPF10K200E, and EPF10K200S devices have 104 EAB local interconnect channels.
EABs can be used to implement synchronous RAM, which is easier to use
than asynchronous RAM. A circuit using asynchronous RAM must
generate the RAM write enable signal, while ensuring that its data and
address signals meet setup and hold time specifications relative to the
write enable signal. In contrast, the EAB’s synchronous RAM generates its
own write enable signal and is self-timed with respect to the input or write
clock. A circuit using the EAB’s self-timed RAM must only meet the setup
and hold time specifications of the global clock.
Column Interconnect
EAB Local
Interconnect (1)
Dedicated Inputs
& Global Signals
DQ
RAM/ROM
256
× 16
512
× 8
1,024
× 4
2,048
× 2
Data In
Address
Write Enable
Data Out
4, 8, 16, 32
DQ
4
8, 4, 2, 1
8, 9, 10, 11
Row Interconnect
Dedicated
Clocks
2
4, 8
Chip-Wide
Reset
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相關代理商/技術參數(shù)
參數(shù)描述
EPF10K130EFC484-3 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC484-3N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-1 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-1X 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-2 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256