Figure 31. FLEX 10KE ICCACTIVE " />
參數(shù)資料
型號(hào): EPF10K130EFC484-2X
廠商: Altera
文件頁(yè)數(shù): 97/100頁(yè)
文件大?。?/td> 0K
描述: IC FLEX 10KE FPGA 130K 484-FBGA
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 60
系列: FLEX-10KE®
LAB/CLB數(shù): 832
邏輯元件/單元數(shù): 6656
RAM 位總計(jì): 65536
輸入/輸出數(shù): 369
門數(shù): 342000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FBGA(23x23)
其它名稱: EPF10K130EFC4842X
96
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Figure 31. FLEX 10KE ICCACTIVE vs. Operating Frequency (Part 2 of 2)
Configuration &
Operation
The FLEX 10KE architecture supports several configuration schemes. This
section summarizes the device operating modes and available device
configuration schemes.
Operating Modes
The FLEX 10KE architecture uses SRAM configuration elements that
require configuration data to be loaded every time the circuit powers up.
The process of physically loading the SRAM data into the device is called
configuration. Before configuration, as VCC rises, the device initiates a
Power-On Reset (POR). This POR event clears the device and prepares it
for configuration. The FLEX 10KE POR time does not exceed 50 s.
When configuring with a configuration device, refer to the respective
configuration device data sheet for POR timing information.
0
Frequency (MHz)
600
400
200
50
100
EPF10K200S
ICC Supply
Current (mA)
0
Frequency (MHz)
400
300
200
100
50
100
EPF10K130E
ICC Supply
Current (mA)
0
Frequency (MHz)
600
400
200
50
100
EPF10K200E
ICC Supply
Current (mA)
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EPF10K130EFC484-3 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC484-3N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 369 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EPF10K130EFC672-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 413 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256