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參數(shù)資料
型號(hào): EPF10K130EQI240-2
廠商: Altera
文件頁數(shù): 54/100頁
文件大?。?/td> 0K
描述: IC FLEX 10KE FPGA 130K 240-PQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 24
系列: FLEX-10KE®
LAB/CLB數(shù): 832
邏輯元件/單元數(shù): 6656
RAM 位總計(jì): 65536
輸入/輸出數(shù): 186
門數(shù): 342000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 240-BFQFP
供應(yīng)商設(shè)備封裝: 240-PQFP(32x32)
其它名稱: 544-2206
Altera Corporation
57
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
tCLR
LE register clear delay
tCH
Minimum clock high time from clock pin
tCL
Minimum clock low time from clock pin
Table 24. LE Timing Microparameters (Part 2 of 2)
Note (1)
Symbol
Parameter
Condition
Table 25. IOE Timing Microparameters
Symbol
Parameter
Conditions
tIOD
IOE data delay
tIOC
IOE register control signal delay
tIOCO
IOE register clock-to-output delay
tIOCOMB
IOE combinatorial delay
tIOSU
IOE register setup time for data and enable signals before clock; IOE register
recovery time after asynchronous clear
tIOH
IOE register hold time for data and enable signals after clock
tIOCLR
IOE register clear time
tOD1
Output buffer and pad delay, slow slew rate = off, VCCIO = 3.3 V
C1 = 35 pF (2)
tOD2
Output buffer and pad delay, slow slew rate = off, VCCIO = 2.5 V
C1 = 35 pF (3)
tOD3
Output buffer and pad delay, slow slew rate = on
C1 = 35 pF (4)
tXZ
IOE output buffer disable delay
tZX1
IOE output buffer enable delay, slow slew rate = off, VCCIO = 3.3 V
C1 = 35 pF (2)
tZX2
IOE output buffer enable delay, slow slew rate = off, VCCIO = 2.5 V
C1 = 35 pF (3)
tZX3
IOE output buffer enable delay, slow slew rate = on
C1 = 35 pF (4)
tINREG
IOE input pad and buffer to IOE register delay
tIOFD
IOE register feedback delay
tINCOMB
IOE input pad and buffer to FastTrack Interconnect delay
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EPF10K130EQI240-2N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 FPGA - Flex 10K 832 LABs 186 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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