Notes to tables: (1) All timing parameters are described in Tabl" />
參數(shù)資料
型號: EPF10K130EQI240-2
廠商: Altera
文件頁數(shù): 94/100頁
文件大?。?/td> 0K
描述: IC FLEX 10KE FPGA 130K 240-PQFP
產(chǎn)品培訓(xùn)模塊: Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝: 24
系列: FLEX-10KE®
LAB/CLB數(shù): 832
邏輯元件/單元數(shù): 6656
RAM 位總計: 65536
輸入/輸出數(shù): 186
門數(shù): 342000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 240-BFQFP
供應(yīng)商設(shè)備封裝: 240-PQFP(32x32)
其它名稱: 544-2206
Altera Corporation
93
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Notes to tables:
(1)
All timing parameters are described in Tables 24 through 30 in this data sheet.
(2)
This parameter is measured without the use of the ClockLock or ClockBoost circuits.
(3)
This parameter is measured with the use of the ClockLock or ClockBoost circuits.
tLABCASC
0.5
1.0
1.4
ns
Table 78. EPF10K200S External Timing Parameters
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Unit
Min
Max
Min
Max
Min
Max
tDRR
9.0
12.0
16.0
ns
tINSU (2)
3.1
3.7
4.7
ns
tINH (2)
0.0
ns
tOUTCO (2)
2.0
3.7
2.0
4.4
2.0
6.3
ns
tINSU(3)
2.1
2.7
ns
tINH (3)
0.0
ns
0.5
2.7
0.5
3.4
ns
tPCISU
3.0
4.2
ns
tPCIH
0.0
ns
tPCICO
2.0
6.0
2.0
8.9
ns
Table 79. EPF10K200S External Bidirectional Timing Parameters
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Unit
Min
Max
Min
Max
Min
Max
tINSUBIDIR (2)
2.3
3.4
4.4
ns
tINHBIDIR (2)
0.0
ns
tINSUBIDIR (3)
3.3
4.4
ns
tINHBIDIR (3)
0.0
ns
tOUTCOBIDIR (2)
2.0
3.7
2.0
4.4
2.0
6.3
ns
tXZBIDIR (2)
6.9
7.6
9.2
ns
tZXBIDIR (2)
5.9
6.6
ns
tOUTCOBIDIR (3)
0.5
2.7
0.5
3.4
ns
tXZBIDIR (3)
6.9
7.6
9.2
ns
tZXBIDIR (3)
5.9
6.6
ns
Table 77. EPF10K200S Device Interconnect Timing Microparameters (Part 2 of 2)
Note (1)
Symbol
-1 Speed Grade
-2 Speed Grade
-3 Speed Grade
Unit
Min
Max
Min
Max
Min
Max
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EPF10K130EQI240-2N 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Flex 10K 832 LABs 186 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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