Data Sheet
ADF4360-4
Rev. B | Page 23 of 24
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-2
04-
09-
2012-
A
1
0.50
BSC
PIN 1
INDICATOR
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.45
2.30 SQ
2.15
24
7
19
12
13
18
6
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 24. 24-Lead Lead Frame Chip-Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Frequency Range
Package Description
Package Option
ADF4360-4BCPZ
40°C to +85°C
1450 MHz to 1750 MHz
24-Lead LFCSP_VQ
CP-24-2
ADF4360-4BCPZRL
40°C to +85°C
1450 MHz to 1750 MHz
24-Lead LFCSP_VQ
CP-24-2
ADF4360-4BCPZRL7
40°C to +85°C
1450 MHz to 1750 MHz
24-Lead LFCSP_VQ
CP-24-2
EV-ADF4360-4EB1Z
Evaluation Board
1
Z = RoHS Compliant Part.