TA = 25°C, unless othe" />
參數(shù)資料
型號(hào)： EVAL-AD5116EBZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 13/16頁(yè)
文件大?。?/td> 0K
描述： BOARD EVAL FOR AD5116
標(biāo)準(zhǔn)包裝： 1
系列： *
AD5116
Data Sheet
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to GND
–0.3 V to +7.0 V
VA, VW , VB to GND
GND 0.3 V to VDD + 0.3 V
IA, IW , IB
Pulsed1
Frequency > 10 kHz
RAW = 5 k and 10 k
±6 mA/d2
RAW = 80 k
±1.5 mA/d2
Frequency ≤ 10 kHz
RAW = 5 k and 10 k
±6 mA/√d2
RAW = 80 k
±1.5 mA/√d2
Continuous
RAW = 5 k and 10 k
±6mA
RAW = 80 k
±1.5mA
Push Button Inputs
0.3 V to +7 V or VDD + 0.3 V
(whichever is less)
Operating Temperature Range3
40°C to +125°C
Maximum Junction Temperature (TJ Max)
150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time At Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJ max TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Pulse duty factor.
3 Includes programming of EEPROM memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is defined by JEDEC specification JESD-51, and the value is
dependent on the test board and test environment.
Table 5. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
8-Lead LFCSP
901
25
°C/W
1 JEDEC 2S2P test board, still air (0 m/sec air flow).
ESD CAUTION
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