AD5273
Rev. H | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter
Rating
VDD to GND
0.3 V +6.5 V
VA, VB, VW to GND
GND, VDD
Maximum Current
IWB, IWA Pulsed
±20 mA
IWB Continuous (RWB ≤ 1 kΩ, A Open)1 ±4 mA
IWA Continuous (RWA ≤ 1 kΩ, B Open)
±4 mA
Digital Input and Output Voltage to GND
0 V, VDD
Operating Temperature Range
40°C to +105°C
Maximum Junction Temperature (TJ max)
150°C
Storage Temperature
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Thermal Resistance θJA, SOT-232 230°C/W
1 Maximum terminal current is bounded by the maximum current handling
of the switches, the maximum power dissipation of the package; the maxi-
mum applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Package power dissipation = (TJ max – TA)/θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION