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參數(shù)資料
| 型號(hào)： | EVAL-ADF4350EB1Z |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 19/32頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVALUATION BOARD 1 FOR ADF4350 |
| 設(shè)計(jì)資源： | Broadband Low EVM Direct Conversion Transmitter Using LO Divide-by-2 Modulator (CN0144) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計(jì)時(shí)，頻率合成器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADF4350 |
| 主要屬性： | 帶 VCO 的單路分?jǐn)?shù)-N 和整數(shù)-N PLL |
| 次要屬性： | USB 接口 |
| 已供物品： | 板，纜線，CD |
| 其它名稱： | Q4437453 Q4841122 Q5095480 Q5242312 Q5416250 |
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ADF4350
Rev. A | Page 26 of 32
INTERFACING
The ADF4350 has a simple SPI-compatible serial interface for
writing to the device. CLK, DATA, and LE control the data
transfer. When LE goes high, the 32 bits that have been clocked
into the appropriate register on each rising edge of CLK are
transferred to the appropriate latch. See Figure 2 for the timing
diagram and Table 5 for the register address table.
ADuC70xx Interface
Figure 35 shows the interface between the ADF4350 and the
ADuC70xx family of analog microcontrollers. The ADuC70xx
family is based on an AMR7 core, although the same interface
can be used with any 8051-based microcontroller. The micro-
controller is set up for SPI master mode with CPHA = 0. To
initiate the operation, the I/O port driving LE is brought low.
Each latch of the ADF4350 needs a 32-bit word. This is accom-
plished by writing four 8-bit bytes from the microcontroller to
the device. When the last byte is written, the LE input should be
brought high to complete the transfer.
On first applying power to the ADF4350, it needs six writes
(one each to R5, R4, R3, R2, R1, R0) for the output to become
active.
I/O port lines on the microcontroller are also used to control
power-down (CE input) and to detect lock (MUXOUT
configured as lock detect and polled by the port input).
When operating in the mode described, the maximum SPI
transfer rate of the ADuC7023 is 20 Mbps. This means that
the maximum rate at which the output frequency can be
changed is 833 kHz. If using a faster SPI clock just make sure
the SPI timing requirements listed in Table 2 are adhered to.
07
32
5-
02
2
ADuC70xx
ADF4350
CLK
DATA
LE
CE
MUXOUT
(LOCK DETECT)
SCLOCK
MOSI
I/O PORTS
Figure 35. ADuC812 to ADF4350 Interface
ADSP-BF527 Interface
Figure 36 shows the interface between the ADF4351 and the
Blackfin ADSP-BF527 digital signal processor (DSP). The
ADF4351 needs a 32-bit serial word for each latch write. The
easiest way to accomplish this using the Blackfin family is to use
the autobuffered transmit mode of operation with alternate
framing. This provides a means for transmitting an entire block
of serial data before an interrupt is generated. Set up the word
length for 8 bits and use three memory locations for each 32-bit
word. To program each 32-bit latch, store the four 8-bit bytes,
enable the autobuffered mode, and write to the transmit register
of the DSP. This last operation initiates the autobuffer transfer.
Make sure the clock speeds are within the maximum limits
outlined in Table 2.
07
32
5-
02
3
ADSP-BF527
ADF4350
CLK
DATA
LE
CE
MUXOUT
(LOCK DETECT)
SCK
MOSI
GPIO
I/O FLAGS
Figure 36. ADSP-BF527 to ADF4350 Interface
PCB DESIGN GUIDELINES FOR A CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-32-2) are rectangular.
The PCB pad for these is to be 0.1 mm longer than the package
land length and 0.05 mm wider than the package land width.
The land is to be centered on the pad. This ensures the solder
joint size is maximized. The bottom of the chip scale package
has a central thermal pad.
The thermal pad on the PCB is to be at least as large as the
exposed pad. On the PCB, there is to be a minimum clearance
of 0.25 mm between the thermal pad and the inner edges of the
pad pattern. This ensures that shorting is avoided.
Thermal vias can be used on the PCB thermal pad to improve
the thermal performance of the package. If vias are used, they
are to be incorporated in the thermal pad at 1.2 mm pitch grid.
The via diameter is to be between 0.3 mm and 0.33 mm, and the
via barrel is to be plated with 1 oz. of copper to plug the via.
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| EVAL-ADF4350EB2Z | 功能描述:EVALUATION BOARD 2 FOR ADF4350 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:- 標(biāo)準(zhǔn)包裝:1 系列:PSoC® 主要目的:電源管理，熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板，CD，電源 |
| EVAL-ADF4351EB1Z | 功能描述:BOARD 1 EVAL FOR ADF4351 RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:* 標(biāo)準(zhǔn)包裝:1 系列:- 主要目的:電信，線路接口單元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要屬性:T1/J1/E1 LIU 次要屬性:- 已供物品:板，電源，線纜，CD 其它名稱:82EBV2081 |
| EVAL-ADF4360-0EB1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Integrated Synthesizer and VCO |
| EVAL-ADF4360-1EB1 | 制造商:Analog Devices 功能描述:Evaluation Board For ADF4360-1 |
| EVAL-ADF4360-1EBZ1 | 功能描述:BOARD EVALUATION FOR ADF4360-1 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 主要目的:電源管理，電池充電器 嵌入式:否 已用 IC / 零件:MAX8903A 主要屬性:1 芯鋰離子電池 次要屬性:狀態(tài) LED 已供物品:板 |
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