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參數(shù)資料
| 型號： | EVAL-ADV7623EB1Z |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 15/16頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR ADV7623 |
| 標準包裝： | 1 |
| 系列： | Xpressview™ |
| 主要目的： | 視頻，視頻處理 |
| 已用 IC / 零件： | ADV7623 |
| 已供物品： | 板 |
ADV7623
Data Sheet
Rev. D | Page 8 of 16
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
CVDD to GND
2.2 V
DVDD to GND
2.2 V
PVDD to GND
2.2 V
DVDDIO to GND
4.0 V
TVDD to GND
4.0 V
TXAVDD to GND
2.2 V
TXPVDD to GND
2.2 V
TXPLVDD to GND
2.2 V
Digital Inputs Voltage to GND
GND 0.3 V to DVDDIO + 0.3 V
up to a maximum of 4.0 V
5 V Tolerant Digital Inputs to GND1
5.5 V
Digital Output Voltage to GND
GND 0.3 V to DVDDIO + 0.3 V
up to a maximum of 4.0 V
XTAL, XTAL1 Pins
0.3 V to PVDD to +0.3 V
Maximum Junction Temperature
(TJ MAX)
125°C
Storage Temperature
150°C
Infrared Reflow, Soldering (20 sec)
260°C
1
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,
DDCA_SDA, DDCB_SCL, DDCB_SDA, DDCC_SCL, DDCC_SDA, DDCD_SCL,
DDCD_SDA, TXDDC_SDA, TXDDC_SCL, HP_CTRLA, HP_CTRLB, HP_CTRLC,
HP_CTRLD, HPD_ARC, 5V_DETA, 5V_DETB, 5V_DETC, 5V_DETD, PWRDN,
CEC, ARC+.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7623, turn
off the unused sections of the part.
Due to printed circuit board (PCB) metal variation and, thus,
variation in PCB heat conductivity, the value of θJA may differ
for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θJA value.
The maximum junction temperature (TJMAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured package surface temperature
and applies only when no heat sink is used on the DUT:
TJ = TS + (ΨJT × WTOTAL)
where:
TS = the package surface temperature (°C).
ΨJT = 0.6°C/W for a 144-lead LQFP.
WTOTAL = ((CVDD × ICVDD) + (DVDD × IDVDD) +
(PVDD × IPVDD) + (DVDDIO × IDVDDIO) +
(0.7 × TVDD × ITVDD) + (TXAVDD × ITXAVDD) +
(TXPVDD × ITXPVDD) + (TXPLVDD × ITXPLVDD))
Note that for WTOTAL, 5% of TVDD power is dissipated on the
part itself.
ESD CAUTION
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