參數(shù)資料
型號(hào)： FAN5355MP07X
廠商： FAIRCHILD SEMICONDUCTOR CORP
元件分類： 穩(wěn)壓器
英文描述： 1.8 A SWITCHING CONTROLLER, 3350 kHz SWITCHING FREQ-MAX, PDSO10
封裝： 3 X 3 MM, GREEN, MO-229WEED-5, MLP-10
文件頁(yè)數(shù)： 22/27頁(yè)
文件大?。?/td> 1995K
代理商： FAN5355MP07X
2008 Fairchild Semiconductor Corporation
4
www.fairchildsemi.com
FAN5355 Rev. 1.0.4
FA
N
5355
—
1A
/
0.8A
,3M
hz.
D
igit
a
lly
Prog
rammabl
e
TinyB
u
ck
TM
Regulator
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
Parameter
Min.
Max.
Units
AVIN, SW, PVIN Pins
-0.3
6.5
V
VCC
Other Pins
-0.3
AVIN + 0.3
(8)
V
Human Body Model per JESD22-A114
3.5
KV
ESD
Electrostatic Discharge Protection Level
Charged Device Model per JESD22-C101
1.5
KV
TJ
Junction Temperature
–40
+150
°C
TSTG
Storage Temperature
–65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
Note:
8.
Lesser of 6.5V or VCC+0.3V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Units
VIN
Supply Voltage
2.7
5.5
V
f
Frequency Range
2.7
3.3
MHz
VSW
SDA and SCL Voltage Swing
(9)
2.5
V
TA
Ambient Temperature
–40
+85
°C
TJ
Junction Temperature
–40
+125
°C
Note:
9.
The I
2C interface operates with tHD;DAT = 0 as long as the pull-up voltage for SDA and SCL is less than 2.5V. If voltage
swings greater than 2.5V are required (for example if the I
2C bus is pulled up to VIN), the minimum tHD;DAT must be
increased to 80ns. Most I
2C masters change SDA near the midpoint between the falling and rising edges of SCL, which
provides ample tHD;DAT .
Dissipation Ratings(10)
Package
RθJA
(11)
Power Rating at TA ≤ 25°C
Derating Factor > TA = 25C
Molded Leadless Package (MLP)
49C/W
2050mW
21mW/C
Wafer-Level Chip-Scale Package (WLCSP)
110C/W
900mW
9mW/C
Notes:
10. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any
allowable ambient temperature is PD = [TJ(max) - TA ] / θJA.
11. This thermal data is measured with high-K board (four-layer board according to JESD51-7 JEDEC standard).
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