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參數(shù)資料
| 型號(hào)： | HA5024IBZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 9/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP QUAD 125MHZ 20-SOIC |
| 標(biāo)準(zhǔn)包裝： | 38 |
| 應(yīng)用： | 電流反饋 |
| 電路數(shù)： | 4 |
| -3db帶寬： | 125MHz |
| 轉(zhuǎn)換速率： | 350 V/µs |
| 電流 - 電源： | 7.5mA |
| 電流 - 輸出 / 通道： | 20mA |
| 電壓 - 電源，單路/雙路(±)： | ±4.5 V ~ 18 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-SOIC W |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁面： | 1234 (CN2011-ZH PDF) |
2
3550.6
February 8, 2006
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 36V
DC Input Voltage (Note 3) . . . . . . . . . . . . . . . . . . . . . . . .
±V
SUPPLY
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10V
Output Current (Note 4) . . . . . . . . . . . . . . . . Short Circuit Protected
ESD Rating (Note 3)
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .2000V
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
Supply Voltage Range (Typical) . . . . . . . . . . . . . . . .
±4.5V to ±15V
Thermal Resistance (Typical, Note 2)
θ
JA (°C/W)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
Maximum Junction Temperature (Note 1) . . . . . . . . . . . . . . . . . 175°C
Maximum Junction Temperature (Plastic Package, Note 1) . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Maximum power dissipation, including output load, must be designed to maintain junction temperature below 175°C for die, and below 150°C
for plastic packages. See Application Information section for safe operating area information.
2.
θJA is measured with the component mounted on an evaluation PC board in free air.
3. The non-inverting input of unused amplifiers must be connected to GND.
4. Output is protected for short circuits to ground. Brief short circuits to ground will not degrade reliability, however, continuous (100% duty cycle)
output current should not exceed 15mA for maximum reliability.
Electrical Specifications
VSUPPLY = ±5V, RF = 1k, AV = +1, RL = 400, CL ≤ 10pF,Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
(NOTE 11)
TEST
LEVEL
TEMP.
(°C)
MIN
TYP
MAX
UNITS
INPUT CHARACTERISTICS
Input Offset Voltage (VIO)A
25
-
0.8
3
mV
AFull
-
5
mV
Delta VIO Between Channels
A
Full
-
1.2
3.5
mV
Average Input Offset Voltage Drift
B
Full
-
5
-
V/°C
VIO Common Mode Rejection Ratio
Note 5
A
25
53
-
dB
A
Full
50
-
dB
VIO Power Supply Rejection Ratio
±3.5V ≤ VS ≤ ±6.5V
A
25
60
-
dB
AFull
55
-
dB
Input Common Mode Range
Note 5
A
Full
±2.5
-
V
Non-Inverting Input (+IN) Current
A
25
-
3
8
A
AFull
-
20
A
+IN Common Mode Rejection
(+IBCMR =)
Note 5
A
25
-
0.15
A/V
AFull
-
0.5
A/V
+IN Power Supply Rejection
±3.5V ≤ V
S ≤ ±6.5V
A
25
-
0.1
A/V
AFull
-
0.3
A/V
Inverting Input (-IN) Current
A
25,85
-
4
12
A
A-40
-
10
30
A
Delta -IN BIAS Current Between Channels
A
25,85
-
6
15
A
A-40
-
10
30
A
-IN Common Mode Rejection
Note 5
A
25
-
0.4
A/V
AFull
-
1.0
A/V
1
R
IN
----------
HA5024
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