- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄371780 > HCS112KMSR (INTERSIL CORP) Radiation Hardened Dual JK Flip-Flop PDF資料下載
參數(shù)資料
| 型號(hào)： | HCS112KMSR |
| 廠商： | INTERSIL CORP |
| 元件分類： | 通用總線功能 |
| 英文描述： | Radiation Hardened Dual JK Flip-Flop |
| 中文描述： | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP16 |
| 封裝： | CERAMIC, DFP-16 |
| 文件頁(yè)數(shù)： | 9/9頁(yè) |
| 文件大?。?/td> | 180K |
| 代理商： | HCS112KMSR |
19
HCS112MS
Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCS112MS
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS112 is TA14341A.
CP1
(1)
KA
(2)
JA (3)
SA (4)
QA (5)
QA (6)
QB (7)
GND
(8)
QB
(9)
SB
(10)
(11) JB
(12) KB
(13) CPB
(14) RB
(15) RA
VCC
(16)
Spec Number
518830
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HCS112MS | Dual JK Flip-Flop(雙J-K觸發(fā)器) |
| HCS112D | Radiation Hardened Dual JK Flip-Flop |
| HCS112DMSR | Radiation Hardened Dual JK Flip-Flop |
| HCS112K | Radiation Hardened Dual JK Flip-Flop |
| HCS112HMSR | Radiation Hardened Dual JK Flip-Flop |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HCS112MS | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Dual JK Flip-Flop |
| HCS114-01GG | 制造商:Advanced Interconnect 功能描述: |
| HCS11DMSR | 制造商:Intersil Corporation 功能描述:AND GATE 3-ELEM 3-IN CMOS 14PIN SBCDIP - Rail/Tube |
| HCS11KMSR | 制造商:Intersil Corporation 功能描述:AND GATE 3-ELEM 3-IN CMOS 14CFPAK - Bulk |
| HCS11MS | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Triple 3-Input AND Gate |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。