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King Billion Electronics Co., Ltd
駿
億
電
子
股
份
有
限
公
司
HE85750
HE80000 SERIES
5.
Pad Location
2003/7/30
This specification is subject to change without notice. Please contact sales person for the latest version before use.
4
V1.52E
Die Size: 7290 μm * 1760 μm
。
Substrate connect with GND
。
P
C
M
S
G
[4
4]
C
M
S
G
[4
3]
C
M
S
G
[4
2]
C
M
S
G
[4
1]
C
M
S
G
[4
0]
C
M
S
G
[3
9]
C
M
S
G
[3
8]
C
M
S
G
[3
7]
C
M
S
G
[3
6]
C
M
S
G
[3
5]
C
M
S
G
[3
4]
C
M
S
G
[3
3]
C
M
S
G
[3
2]
C
O
M
[1
2]
C
O
M
[1
1]
C
O
M
[1
0]
C
O
M
[9]
C
O
M
[8]
C
O
M
[7]
C
O
M
[6]
C
O
M
[5]
C
O
M
[4]
C
O
M
[3]
C
O
M
[2]
C
O
M
[1]
C
O
M
[0]
CMSG[45]
CMSG[46]
CMSG[47]
SEG[47]
SEG[46]
SEG[45]
SEG[44]
SGKY[43]
SGKY[42]
SGKY[41]
SGKY[40]
SGKY[39]
SGKY[38]
SGKY[37]
SGKY[36]
SGKY[35]
SGKY[34]
SGKY[33]
SGKY[32]
SGKY[31]
SGKY[30]
SGKY[29]
SGKY[28]
SGKY[27]
SGKY[26]
SGKY[25]
SGKY[24]
PRT14[7]
PRT14[6]
PRT14[5]
PRT14[4]
PRT14[3]
PRT14[2]
PRT14[1]
PRT14[0]
PRT15[7]
PRT15[6]
PRT15[5]
PRT15[4]
PRT15[3]
PRT15[2]
PRT15[1]
PRT15[0]
PRT17[7]
PRT17[6]
PRT17[5]
PRT17[4]
PRT17[3]
PRT17[2]
PRT17[1]
PRT17[0]
COM[15]
COM[14]
COM[13]
COM[31]
COM[30]
COM[29]
COM[28]
COM[27]
COM[26]
COM[25]
COM[24]
COM[23]
COM[22]
COM[21]
COM[20]
COM[19]
COM[18]
COM[17]
COM[16]
PRTC[4]
PRTC[5]
PRTC[6]
PRTC[7]
PWM
GND_PWM
PRTD[0]
PRTD[1]
PRTD[2]
PRTD[3]
PRTD[4]
PRTD[5]
PRTD[6]
PRTD[7]
VDD
SXI
SXO
TSTP_P
FXI
FXO
RSTP_N
OPO
OPIP
OPIN
VO
GND
LVG
LR0
LR1
LR2
LR3
LR4
LV3
LV2
LV1
LC2
LC1