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參數(shù)資料
| 型號： | HGTD3N60A4S |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 功率晶體管 |
| 英文描述： | OSCILLATORS 100PPM 0+70 3.3V 4 4.000MHZ TS HCMOS 5X7MM 4PAD SMD |
| 中文描述： | 17 A, 600 V, N-CHANNEL IGBT, TO-252AA |
| 封裝： | TO-252AA, 3 PIN |
| 文件頁數(shù)： | 7/9頁 |
| 文件大小： | 227K |
| 代理商： | HGTD3N60A4S |
7
HGTD3N60C3, HGTD3N60C3S
TO-251AA
3 LEAD JEDEC TO-251AA PLASTIC PACKAGE
LEAD 1
-
GATE
LEAD 2
-
COLLECTOR
LEAD 3
-
EMITTER
TERM. 4
-
COLLECTOR
b
2
E
A
c
SEATING
PLANE
L
1
D
L
b
e
1
2
3
b
1
H
1
J
1
A
1
e
1
TERM. 4
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.086
0.094
2.19
2.38
-
A
1
b
0.018
0.022
0.46
0.55
3, 4
0.028
0.032
0.72
0.81
3, 4
b
1
b
2
c
0.033
0.040
0.84
1.01
3
0.205
0.215
5.21
5.46
3, 4
0.018
0.022
0.46
0.55
3, 4
D
0.270
0.290
6.86
7.36
-
E
0.250
0.265
6.35
6.73
-
e
0.090 TYP
2.28 TYP
5
e
1
H
1
J
1
L
0.180 BSC
4.57 BSC
5
0.035
0.045
0.89
1.14
-
0.040
0.045
1.02
1.14
6
0.355
0.375
9.02
9.52
-
L
1
0.075
0.090
1.91
2.28
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-251AA outline dated 9-88.
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 10-95.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HGTD3N60A4S9A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | IGBT | N-CHAN | 600V V(BR)CES | 8A I(C) | TO-252AA |
| hgtd3n60b3 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HGTD3N60B3S | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HGTD3N60B3S9A | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HGTD3N60C3 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
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