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參數(shù)資料
| 型號(hào)： | HSMS-0006 |
| 英文描述： | Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成電路應(yīng)用的肖特基勢(shì)壘二極管) |
| 中文描述： | 肖特基芯片的混合集成電路（混合集成電路應(yīng)用的肖特基勢(shì)壘二極管） |
| 文件頁數(shù)： | 1/4頁 |
| 文件大?。?/td> | 36K |
| 代理商： | HSMS-0006 |
Schottky Barrier Chips for
Hybrid Integrated Circuits
Technical Data
Features
Thermocompression/
Thermosonically Bondable
Gold Metallization
Silicon Nitride Passivation
Uniform Electrical
Characteristics
Batch Matched Versions
Available
Planar Construction
Available in Many Electrical
Selections
Ideal for Hybrid Integrated
Circuits
HSMS-0005/06
HSMS-8002/12
Chip Dimensions
D
Y
Z
X
2
X
DIMENSIONS
D
X
Y
Z
Top Contact
NOTES:
1. Dimensions in mIcrons (1/1000 inch).
2. Dimension tolerance is
±
30
μ
.
3. All contact metallization is gold.
PART NO. HSMS-
-0006/-8002
75
(3)
250
(10)
275
(11)
150
(8)
Anode
-0005
55
(2)
250
(10)
250
(10)
150
(6)
Cathode
X
2
Description/Applications
These Schottky chips are de-
signed for hybrid applications at
DC through K-band frequencies.
The passivated planar construc-
tion of these Schottky chips
provides a wide temperature
range capability combined with
broad bandwidth performance.
A variety of chips are provided
which are optimized for various
analog and digital applications.
Typical applications of Schottky
chips are mixing, detecting,
switching, gating, sampling, and
wave shaping.
This series of Schottky diode
chips are specifically designed for
analog and digital hybrid appli-
cations requiring thermosonic or
thermocompression bonding
techniques. The large bonding pad
allows easy bonding. The top
metallization is a layer of gold
deposited on adhesive metal
layers for a tarnish-free surface
that allows either thermosonic or
thermocompression bonding
techniques. The bottom metalli-
zation is also gold, suitable for
epoxy or eutectic die attach
methods.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSMS-8002 | Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成電路應(yīng)用的肖特基勢(shì)壘二極管) |
| HSMS-8012 | Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成電路應(yīng)用的肖特基勢(shì)壘二極管) |
| HSMS-2700 | High Performance Schottky Diode for Transient Suppression(用于瞬變抑制的高性能肖特基二極管) |
| HSMS-2702 | High Performance Schottky Diode for Transient Suppression(用于瞬變抑制的高性能肖特基二極管) |
| HSMS--270B | High Performance Schottky Diode for Transient Suppression(用于瞬變抑制的高性能肖特基二極管) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMS-2700 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Schottky Diode for Transient Suppression |
| HSMS-2700-BLK | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Schottky Diode for Transient Suppression |
| HSMS-2700-BLKG | 功能描述:肖特基二極管與整流器 15 VBR 6.7 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復(fù)時(shí)間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| HSMS-2700-TR1 | 功能描述:DIODE SCHOTTKY 15V 350MA SOT-23 RoHS:否 類別:分離式半導(dǎo)體產(chǎn)品 >> RF 二極管 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 二極管類型:PIN - 單 電壓 - 峰值反向(最大):50V 電流 - 最大:50mA 電容@ Vr, F:0.4pF @ 50V，1MHz 電阻@ Vr, F:4.5 歐姆 @ 10mA，100MHz 功率耗散（最大）:100mW 封裝/外殼:SC-70，SOT-323 供應(yīng)商設(shè)備封裝:3-MCP 包裝:帶卷 (TR) |
| HSMS-2700-TR1G | 功能描述:肖特基二極管與整流器 15 VBR 6.7 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復(fù)時(shí)間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
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