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參數(shù)資料
| 型號： | HSMS-0006 |
| 英文描述： | Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成電路應用的肖特基勢壘二極管) |
| 中文描述： | 肖特基芯片的混合集成電路（混合集成電路應用的肖特基勢壘二極管） |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 36K |
| 代理商： | HSMS-0006 |
Assembly and Handling
Procedures for Schottky
Chips
1. Storage
Devices should be stored in a dry
nitrogen purged desiccator or
equivalent.
2. Cleaning
If required, surface contamination
may be removed with electronic
grade solvents such as freon (T.F.
or T.M.C.), acetone, deionized
water, and methanol used singu-
larly or in combinations. Typical
cleaning times per solvent are one
to three minutes. DI water and
methanol should be used (in that
order) in the final cleansing. Final
drying can be accomplished by
placing the cleaned dice on clean
filter paper and drying with an
infrared lamp for 5–10 minutes.
Acids such as hydrofluoric (HF),
nitric (HNO
3
) and hydrochloric
(HCl) must not be used.
The effects of cleaning methods/
solutions should be verified on
small samples prior to submitting
the entire lot.
Following cleaning, dice should
either be used in assembly
(typically within a few hours) or
stored in clean containers in an
inert atmosphere or a vacuum
chamber.
3. Die Attach
a. Eutectic
Eutectic die attach can be accom-
plished by “scrubbing” the die
with a preform on the header.
(Note—times and temperature
utilized vary depending on the
type of preform.) For example,
310
°
C is suitable for a Au/Sn
preform.
b. Epoxy
For epoxy die-attach, conducive
silver-filler epoxies are recom-
mended. This method can be used
for all Agilent Schottky chips.
4. Wire Bonding
Thermocompression wire bond-
ing is recommended. Suggested
wire is pure gold, 0.7 to 1.5 mil
diameter.
www.semiconductor.agilent.com
Data subject to change.
Copyright 1999 Agilent Technologies
5965-8855E (11/99)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HSMS-8002 | Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成電路應用的肖特基勢壘二極管) |
| HSMS-8012 | Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成電路應用的肖特基勢壘二極管) |
| HSMS-2700 | High Performance Schottky Diode for Transient Suppression(用于瞬變抑制的高性能肖特基二極管) |
| HSMS-2702 | High Performance Schottky Diode for Transient Suppression(用于瞬變抑制的高性能肖特基二極管) |
| HSMS--270B | High Performance Schottky Diode for Transient Suppression(用于瞬變抑制的高性能肖特基二極管) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSMS-2700 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Schottky Diode for Transient Suppression |
| HSMS-2700-BLK | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Performance Schottky Diode for Transient Suppression |
| HSMS-2700-BLKG | 功能描述:肖特基二極管與整流器 15 VBR 6.7 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
| HSMS-2700-TR1 | 功能描述:DIODE SCHOTTKY 15V 350MA SOT-23 RoHS:否 類別:分離式半導體產(chǎn)品 >> RF 二極管 系列:- 標準包裝:3,000 系列:- 二極管類型:PIN - 單 電壓 - 峰值反向(最大):50V 電流 - 最大:50mA 電容@ Vr, F:0.4pF @ 50V，1MHz 電阻@ Vr, F:4.5 歐姆 @ 10mA，100MHz 功率耗散（最大）:100mW 封裝/外殼:SC-70，SOT-323 供應商設備封裝:3-MCP 包裝:帶卷 (TR) |
| HSMS-2700-TR1G | 功能描述:肖特基二極管與整流器 15 VBR 6.7 pF RoHS:否 制造商:Skyworks Solutions, Inc. 產(chǎn)品:Schottky Diodes 峰值反向電壓:2 V 正向連續(xù)電流:50 mA 最大浪涌電流: 配置:Crossover Quad 恢復時間: 正向電壓下降:370 mV 最大反向漏泄電流: 最大功率耗散:75 mW 工作溫度范圍:- 65 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SOT-143 封裝:Reel |
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