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參數(shù)資料
| 型號： | HYM72V1635GS-50 |
| 廠商： | SIEMENS A G |
| 元件分類： | DRAM |
| 英文描述： | 16M x 72-Bit EDO-DRAM Module |
| 中文描述： | 16M X 72 EDO DRAM MODULE, 50 ns, DMA168 |
| 封裝： | DIMM-168 |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 70K |
| 代理商： | HYM72V1635GS-50 |
Semiconductor Group
10
HYM72V1625/35GS-50/-60
16M x 72-ECC EDO-Module
Notes:
1) All voltages are referenced to VSS.
2) ICC1, ICC3, ICC4 and ICC6 depend on cycle rate.
3) ICC1 and ICC4 depend on output loading. Specified values are measured with the output open.
4) Address can be changed once or less while RAS = Vil.In the case of ICC4 it can be changed once or less
during a hyper page mode (EDO) cycle ( thpc).
5) An initial pause of 100
μ
s is required after power-up followed by 8 RAS-only-refresh cycles, before proper
device operation is achieved. In case of using internal refresh counter, a minimum of 8 CAS-before-RAS
initialization cycles instead of 8 RAS cycles are required.
6) AC measurements assume tT = 2 ns.
7) VIH (min.) and VIL (max.) are reference levels for measuring timing of input signals. Also, transition times are
measured between VIH and VIL.
8) The specified timings include buffer, loading and skew delay adders: 2ns minimum, 5ns (CAS, WE, OE,
addresses) maximum delay, no pulse shrinkage to the DRAM device timings. The data and RAS signals are
not buffered, which preserves the DRAMs access specification of 50ns and 60ns.
9) A +5ns timing skew from the DRAM to the module resulted from the addition of line drivers.
10) A -2ns timing skew from the DRAM to the module resulted from the addition of line drivers.
11) A +2ns timing skew from the DRAM to the module resulted from the addition of line drivers.
12) A -2ns (min.) and a -5ns (max.) timing skew from the DRAM to the module resulted from the addition of line
drivers.
13) Measured with the specified current load and 100 pF at Voh = 2.0 V and Vol = 0.8 V. Access time is determined
by the latter of tRAC, tCAC, tAA, tCPA, tOEA. tCAC is measured from tristate.
14) Operation within the tRCD (max.) limit ensures that tRAC (max.) can be met. tRCD (max.) is specified as a
reference point only: If tRCD is greater than the specified tRCD (max.) limit, then access time is controlled by
tCAC.
15) Operation within the tRAD (max.) limit ensures that tRAC (max.) can be met. tRAD (max.) is specified as a
reference point only: If tRAD is greater than the specified tRAD (max.) limit, then access time is controlled by
tAA.
16) Either tRCH or tRRH must be satisfied for a read cycle.
17) tOFF (max.) and tOEZ (max.) define the time at which the outputs achieve the open-circuit condition and are
not referenced to output voltage levels. tOFF is referenced from the rising edge of RAS or CAS, whichever
occurs last.
18) Either tDZC or tDZO must be satisfied.
19) Either tCDD or tODD must be satisfied.
20) tWCS, tRWD, tCWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data
sheet as electrical characteristics only. If tWCS > tWCS (min.), the cycle is an early write cycle and the I/O pin
will remain open-circuit (high impedance) through the entire cycle; if tRWD > tRWD (min.), tCWD > tCWD
(min.), tAWD > tAWD (min.) and tCPWD > tCPWD (min.) , the cycle is a read-write cycle and I/O pins will
contain data read from the selected cells. If neither of the above sets of conditions is satisfied, the condition
of the I/O pins (at access time) is indeterminate.
21) These parameters are referenced to CAS leading edge in early write cycles and to WE leading edge in Read-
Modify-Write cycles.
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| HYM72V2005GS-60 | 2M x 72-Bit EDO-DRAM Module |
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相關代理商/技術參數(shù) |
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| HYM72V1635GS-60 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:16M x 72-Bit EDO-DRAM Module |
| HYM72V1645GU-50 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:3.3V 16M x 64-Bit EDO-DRAM Module 3.3V 16M x 72-Bit EDO-DRAM Module |
| HYM72V1645GU-60 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:3.3V 16M x 64-Bit EDO-DRAM Module 3.3V 16M x 72-Bit EDO-DRAM Module |
| HYM72V1645GU-70 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x72 EDO Page Mode DRAM Module |
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