參數(shù)資料
型號(hào): HYMR212818H
英文描述: 128Mx18|2.5V|40|x8|Direct RDRAM - 256MB RIMM
中文描述: 128Mx18 | 2.5V的| 40 | x8 |直接RDRAM的- 256MB的RIMM的
文件頁(yè)數(shù): 2/18頁(yè)
文件大?。?/td> 291K
代理商: HYMR212818H
Rev. 0.95 / J uly.01
2
RIMM
Module
with 256/288Mb RDRAMs Preliminary
TM
Figure 1: Rambus RIMM Module without heat spreader
Overview
The Rambus
RIMM
TM
module is a general purpose
high-performance memory subsystem suitable for use
in a broad range of applications including computer
memory, personal computers, workstations, and other
applications where high bandwidth and low latency are
required.
The Rambus RIMM module consist of 256/288Mb
Direct Rambus DRAM devices. These are extremely
high-speed CMOS DRAMs organized as 16M words
by 16/18 bits. The use of Rambus Signaling Level
(RSL) technology permits 600MHz ,711MHz or
800MHz transfer rates while using conventional
system and board design technologies. RDRAM
devices are capable of sustained data transfers at 1.25
ns per two bytes (10ns per 16 bytes).
The RDRAM architecture enables the highest
sustained bandwidth for multiple, simultaneous
randomly addressed memory transactions. The
separate control and data buses with independent row
and column control yield over 95% bus efficiency. The
Direct RDRAM's 32-banks architecture supports up to
four simultaneous transactions per device.
Features
w
High speed 800,711 and 600 MHz RDRAM storage
w
184 edge connector pads with 1 mm pad spacing
w
Maximum module PCB size: 133.5mm x 34.93mm x
1.37mm(5.21” x 1.375” x 0.05”)
w
Gold plated edge connector pad contacts
w
Serial Presence Detect(SPD) support
w
Operates from a 2.5 volt supply (
±
5%)
w
Powerdown self refresh modes
w
μ
BGA Package (92 balls)
w
Separate Row and Column buses for higher
efficiency
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available from RIMM modules.
Form Factor
The Rambus RIMM modules are offered in a 184-pad
1mm edge connector pad pitch from factor suitable for
either 184 or 168 contact RIMM connectors. The
RIMM module is suitable for desktop and other system
applications. Figure 1 below, shows an eight device
Rambus RIMM module without heat spreader.
Table 1: Part Number by Frequency and Latency
Organization
I/O Freq.
MHz
t rac (
Row
Access
Time
) ns
32M x 16/18
600
53
32M x 16/18
711
45
32M x 16/18
800
40
128M x 16/18
600
53
128M x 16/18
711
45
128M x 16/18
800
45
128M x 16/18
800
40
32M x 16/18
800
45
256M x 16/18
600
53
256M x 16/18
711
45
256M x 16/18
800
45
256M x 16/18
800
40
Part Number
HYMR23216(18)H-653
HYMR23216(18)H-745
HYMR23216(18)H-840
HYMR212816(18)H-653
HYMR212816(18)H-745
HYMR212816(18)H-845
HYMR212816(18)H-840
HYMR23216(18)H-845
HYMR225616(18)H-653
HYMR225616(18)H-745
HYMR225616(18)H-845
HYMR225616(18)H-840
64M x 16/18
600
53
64M x 16/18
711
45
64M x 16/18
800
40
64M x 16/18
800
45
HYMR26416(18)H-653
HYMR26416(18)H-745
HYMR26416(18)H-840
HYMR26416(18)H-845
相關(guān)PDF資料
PDF描述
HYMR225616H 256Mx16|2.5V|40|x16|Direct RDRAM - 512MB RIMM
HYMR225618H 128Mx18|2.5V|40|x16|Direct RDRAM - 256MB RIMM
HYMR23216H 32Mx16|2.5V|40|x2|Direct RDRAM - 64MB RIMM
HYMR23218H 32Mx18|2.5V|40|x2|Direct RDRAM - 64MB RIMM
HYMR26416H 64Mx16|2.5V|40|x4|Direct RDRAM - 128MB RIMM
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