參數(shù)資料
型號(hào)： I843034AY-06
廠商： INTEGRATED DEVICE TECHNOLOGY INC
元件分類： 時(shí)鐘產(chǎn)生/分配
英文描述： 750 MHz, PROC SPECIFIC CLOCK GENERATOR, PQFP48
封裝： 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-48
文件頁(yè)數(shù)： 8/21頁(yè)
文件大?。?/td> 976K
代理商： I843034AY-06
IDT / ICS 3.3V LVPECL FREQUENCY SYNTHESIZER
16
ICS843034AY-06 REV. A MARCH 7, 2007
ICS843034-06
FEMTOCLOCKS MULTI-RATE 3.3V LVPECL FREQUENCY SYNTHESIZER
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843034-06.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843034-06 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 150mA = 519.75mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power
_MAX
(3.465V, with all outputs switching) = 519.75mW + 60mW = 579.75mW
2.
Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 55.9°C/W per Table 9 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.580W * 55.9°C/W = 102.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 9. THERMAL RESISTANCE
θθθθθ
JA
FOR
48-PIN LQFP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Multi-Layer PCB, JEDEC Standard Test Boards
65.7°C/W
55.9°C/W
52.4°C/W
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