參數(shù)資料
型號: IBM25403GCX-3JC76C2
元件分類: 微控制器/微處理器
英文描述: RISC PROCESSOR, PQFP16
封裝: PLASTIC, QFP-160
文件頁數(shù): 11/54頁
文件大?。?/td> 541K
代理商: IBM25403GCX-3JC76C2
IBM PowerPC 403GCX
19
Package Thermal Specications
The 403GCX is designed to operate within the case temperature range from -40C to 120C. Thermal
resistance values are shown in Table 6:
Notes:
1. Case temperature TmC is measured at top center of case surface with device soldered to circuit board.
2. TmA = TmC – P×θCA, where TmA is ambient temperature.
3. TmCMax = TmJMax – P
×θ
JC, where TmJMax is maximum junction temperature and P is power consumption.
4. The above assumes that the chip is mounted on a card with at least one signal and two power planes.
Electrical Specications
Absolute Maximum Ratings
The absolute maximum ratings in Table 7 below are stress ratings only. Operation at or beyond these
maximum ratings may cause permanent damage to the device.
Table 6. Thermal Resistance (C/Watt)
Parameter
Airow-ft/min (m/sec)
0
(0)
100
(0.51)
200
(1.02)
θ
JC Junction to case
222
θ
CA Case to ambient
PQFP (no heatsink)
37.2
31.6
29.8
Table 7. 403GCX Maximum Ratings
Parameter
Maximum Rating
Supply voltage with respect to GND
-0.5V to +3.8V
Voltage on other pins with respect to GND
-0.5V to +5.5V
Case temperature under bias
-40C to +120C
Storage temperature
-65C to +150C
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