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參數(shù)資料
| 型號(hào)： | IBM25PPC750GLECR5HA3T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 |
| 封裝： | 21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件頁數(shù)： | 50/76頁 |
| 文件大?。?/td> | 1031K |
| 代理商： | IBM25PPC750GLECR5HA3T |
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Datasheet
DD1.X
IBM PowerPC 750GL RISC Microprocessor
Preliminary
System Design Information
Page 54 of 74
750GL_ds_body.fm.1.2
March 13, 2006
5.3
D
ecoupling
R
e
commendations
Cap
a
ci
tor
de
co
upl
ing
is
r
e
qui
re
d
for
the
750
G
L
.Dec
oup
ling
c
apa
ci
tor
s
a
c
t
to
r
e
duc
e
hi
gh
-f
re
q
uen
cy
ch
ip
s
w
it
c
h
in
g
noi
s
e
and
p
ro
vid
e
lo
ca
lize
d
bul
k
ch
ar
ge
s
to
ra
ge
t
o
r
edu
ce
maj
o
rpo
wer
-s
u
rg
e
ef
fec
ts
.G
u
id
el
ine
s
f
o
rhi
gh-
fr
equ
enc
y
noi
s
e
de
co
upl
in
g
wi
llbe
pr
ov
ide
d
i
n
a
s
e
par
ate
app
li-
ca
tio
n
no
te.
Bul
k
dec
ou
pli
ng
re
qui
re
s
a
mo
re
c
o
mp
let
e
un
der
s
tand
in
g
of
the
sy
s
tem
and
sy
s
tem
powe
r
ar
ch
itec
tu
re
,whi
c
h
is
b
e
y
o
n
d
the
sc
op
e
of
thi
s
doc
ume
n
t.
Hig
h
-f
requ
enc
y
dec
ou
pli
ng
ca
pac
ito
rs
s
h
o
u
ld
be
loc
a
ted
a
s
c
lose
as
po
ss
ib
le
to
t
he
p
ro
c
e
s
o
rwi
th
l
o
w
l
e
a
d
in
duc
ta
nce
to
the
g
round
an
d
vo
lta
ge
p
la
nes
.
Dec
oup
ling
c
apa
ci
tor
s
a
re
r
e
co
mme
nde
d
on
th
e
bac
k
o
fthe
c
a
rd
,di
re
c
tly
opp
osi
te
th
e
mod
u
le
.T
he
r
e
c
o
mm
end
ed
pl
ac
em
ent
an
d
num
b
er
o
f
dec
ou
pli
n
g
ca
pac
it
or
s,
34
V
DD
-G
ND
c
apa
ci
tor
s
and
44
O
V
DD
-G
ND
c
apa
ci
tor
s
,ar
e
des
cr
ibed
in
T
h
e
r
e
c
o
m
en
ded
dec
ou
pli
n
g
ca
pac
it
or
sp
ec
ifi
c
a
tio
ns
ar
e
p
ro
v
ided
in
.T
h
e
pla
c
e
m
en
tan
d
us
ag
e
d
e
sc
ri
b
ed
h
e
re
a
re
gui
del
in
es
for
d
e
co
upl
in
g
c
apa
ci
-
tor
s
and
s
houl
d
b
e
ap
pl
ied
for
s
y
s
te
m
de
si
gn
s.
Note
:
T
he
dec
oup
ling
capac
ito
re
le
c
tr
od
es
ar
e
l
o
c
a
te
d
di
re
ct
ly
op
pos
ite
the
ir
c
o
rr
e
s
p
ond
ing
B
G
A
pi
ns
whe
re
po
ss
ib
le.
Al
so
,ea
ch
el
ec
tr
o
de
for
ea
ch
dec
ou
pli
ng
capac
ito
rn
eed
s
to
be
con
nec
ted
to
o
ne
o
r
mor
e
B
G
A
p
ins
(
bal
ls
)wi
th
a
s
h
o
rt
ele
c
tr
ic
a
lp
a
th.
T
h
us
,thr
o
u
g
h
-v
ia
s
a
d
ja
ce
nt
to
t
he
d
e
c
oup
lin
g
c
a
p
a
ci
tor
s
ar
e
r
e
c
o
m
en
ded
.
T
he
c
a
rd
des
ig
ner
c
an
ex
pand
on
the
dec
ou
pli
ng
ca
pac
ito
rr
e
co
mme
nda
tio
n
s
by
doi
ng
the
fol
low
ing
:
A
d
in
g
a
ddi
tio
nal
dec
ou
pl
ing
ca
p
a
c
it
o
rs
.
If
us
ing
a
ddi
tio
nal
dec
oup
ling
c
a
p
a
c
it
o
rs
,v
e
ri
fy
that
th
es
e
add
iti
ona
lca
p
a
c
ito
rs
do
no
t
re
d
u
c
e
the
nu
mbe
rof
c
a
rd
vi
as
o
r
c
a
u
se
t
h
e
via
s
t
o
lo
se
pr
ox
im
ity
to
eac
h
c
a
p
a
ci
tor
e
lec
tr
od
e.
A
d
in
g
a
ddi
tio
nal
thr
o
u
gh-
v
ias
o
rb
lind-
v
ia
s
.
Car
d
te
ch
nol
ogi
es
ar
e
av
ai
la
ble
that
wil
lr
edu
ce
the
i
ndu
ct
a
n
c
e
be
tween
the
d
e
c
oup
ling
c
a
p
a
ci
tor
and
the
B
G
A
p
in
(
b
a
ll)
.R
epl
ac
ing
si
ngl
e
vi
as
wi
th
m
u
lt
ipl
e
v
ias
is
c
e
rt
ain
ly
ap
pr
ov
ed.
Pl
ac
e
G
ND
v
ia
s
c
los
e
to
V
DD
or
O
V
DD
vi
as
to
r
e
d
u
c
e
l
oop
in
duc
tanc
e.
T
a
b
le
5
-4
.
R
e
c
o
mme
nde
d
De
co
upl
ing
Cap
a
ci
tor
S
pec
if
ic
ati
ons
It
em
Des
c
ript
ion
D
e
coupling
c
a
p
a
cit
o
rsp
ecif
icat
ions:
T
y
pe
X5R
or
Y5V
10
V
minimum
0402
size
40
×
20
mils,
nom
inall
y
1.
0
m
×
0.
5
m
±
0.
1
mm
on
bot
h
dimens
ions
100
nF
R
e
comm
ended
minimum
n
u
mber
of
decou-
pling
capacit
ors
on
the
back
of
t
h
e
car
d
:
34
V
DD
-G
ND
capac
it
ors
44
O
V
DD
-G
ND
capac
it
ors
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