參數(shù)資料
型號: IBM25PPC750GLECR5HA3T
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292
封裝: 21X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件頁數(shù): 60/76頁
文件大?。?/td> 1031K
代理商: IBM25PPC750GLECR5HA3T
Datasheet
IBM PowerPC 750GL RISC Microprocessor
Preliminary
DD1.X
750GL_ds_body.fm 1.2
March 13, 2006
System Design Information
Page 63 of 74
5.6 Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package,
Note: This section is based on preliminary information and is subject to change.
Figure 5-6. IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector
HRESET from RISCWatch
System HRESET
HRESET to PowerPC 750GL
TRST to PowerPC 750GL
SRESET to PowerPC 750GL
SRESET from RISCWatch
System SRESET
TRST from RISCWatch
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