參數(shù)資料
型號: ICS843002CY-31LFT
元件分類: 時鐘產(chǎn)生/分配
英文描述: 700 MHz, OTHER CLOCK GENERATOR, PQFP64
封裝: 10 X 10 MM, 1 MM HEIGHT, ROHS COMPLIANT, TQFP-64
文件頁數(shù): 15/27頁
文件大?。?/td> 463K
代理商: ICS843002CY-31LFT
843002CY-31
www.icst.com/products/hiperclocks.html
REV. B NOVEMBER 7, 2005
22
Integrated
Circuit
Systems, Inc.
ICS843002-31
700MHZ FEMTOCLOCKSVCXO BASED
FREQUENCY TRANSLATOR AND JITTER ATTENUATOR
PRELIMINARY
V
CC - 2V
50
Ω
50
Ω
RTT
Z
o = 50Ω
Z
o = 50Ω
FOUT
FIN
RTT =
Z
o
1
((V
OH + VOL) / (VCC – 2)) – 2
3.3V
125
Ω
125
Ω
84
Ω
84
Ω
Z
o = 50Ω
Z
o = 50Ω
FOUT
FIN
The clock layout topology shown below is a typical termi-
nation for LVPECL outputs. The two different layouts men-
tioned are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, ter-
minating resistors (DC current path to ground) or current
sources must be used for functionality. These outputs are
FIGURE 7B. LVPECL OUTPUT TERMINATION
FIGURE 7A. LVPECL OUTPUT TERMINATION
designed to drive 50
Ω transmission lines. Matched imped-
ance techniques should be used to maximize operating
frequency and minimize signal distortion. Figures 7A and
7B show two different layouts which are recommended only
as guidelines. Other suitable clock layouts may exist and it
would be recommended that the board designers simulate
to guarantee compatibility across all printed circuit and
clock component process variations.
TERMINATION FOR LVPECL OUTPUTS
EXPOSED PAD
Expose Metal Pad
(GROUND PAD)
GROUND PLANE
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
THERM AL VIA
SOLDER M ASK
FIGURE 6. P.C. BOARD FOR EXPOSED PADTHERMAL RELEASE PATH EXAMPLE
THERMAL RELEASE PATH
The exposed metal pad provides heat transfer from the
device to the P.C. board. The exposed metal pad is ground
pad connected to ground plane through thermal via. The
exposed pad on the device to the exposed metal pad on the
PCB is contacted through solder as shown in Figure 6. For
further information, please refer to the Application Note on
Surface Mount Assembly of Amkor’s Thermally /Electrically
Enhance Leadframe Base Package, Amkor Technology.
相關(guān)PDF資料
PDF描述
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