IDT / ICS PCI EXPRESS/JITTER ATTENUATOR
參數(shù)資料
型號: ICS874002AGLF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 2/15頁
文件大?。?/td> 0K
描述: IC JITTER ATTENUATOR 20-TSSOP
產(chǎn)品培訓(xùn)模塊: PCI-Express
標(biāo)準(zhǔn)包裝: 74
系列: HiPerClockS™, PCI Express® (PCIe)
類型: 扇出緩沖器(分配),漂移衰減器
PLL:
主要目的: PCI Express(PCIe)
輸入: HCSL,LVDS,LVHSTL,LVPECL,SSTL
輸出: LVDS
電路數(shù): 1
比率 - 輸入:輸出: 1:2
差分 - 輸入:輸出: 是/是
頻率 - 最大: 160MHz
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 20-TSSOP
包裝: 管件
產(chǎn)品目錄頁面: 1250 (CN2011-ZH PDF)
其它名稱: 800-1213
800-1213-5
800-1213-ND
874002AGLF
IDT / ICS PCI EXPRESS/JITTER ATTENUATOR
10
ICS874002AG REV. A DECEMBER 6, 2006
ICS874002
PCI EXPRESS/JITTER ATTENUATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS874002.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS874002 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX
= V
DD_MAX
* (I
DD_MAX
+ I
DDA_MAX
) = 3.465V * (80mA + 12mA) = 318.78mW
Power (outputs)
MAX
= V
DDO_MAX
* I
DDO_MAX
= 3.465V * 110mA = 381.15mW
Total Power
_MAX
= 318.78mW + 381.15mW = 699.93mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.700W * 66.6°C/W = 116.6°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-LEAD TSSOP, FORCED CONVECTION
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
98.0°C/W
88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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