參數(shù)資料
型號: IDT707278S25PFI
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: DRAM
英文描述: HIGH-SPEED 32K x 16 BANK-SWITCHABLE DUAL-PORTED SRAM WITH EXTERNAL BANK SELECTS
中文描述: 32K X 16 DUAL-PORT SRAM, 25 ns, PQFP100
封裝: 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
文件頁數(shù): 5/16頁
文件大?。?/td> 135K
代理商: IDT707278S25PFI
6.42
IDT707278S/L
32K x 16 Bank-Switchable Dual-Ported SRAM with External Bank Selects Industrial and Commercial Temperature Ranges
5
%()
"
-$01$0
#*23)
3
456378"
"
#
495: 46;<"#=
)**0
*
(0
#*23
"
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUMRATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximumrating conditions for extended periods may affect
reliability.
2. V
TERM
must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns
maximum and is limted to < 20mA for the period of V
TERM
> Vcc + 10%.
NOTES:
1. V
IL
> -1.5V for pulse width less than 10ns.
2. V
TERM
must not exceed Vcc + 10%.
NOTES:
1. This is the parameter T
A
. This is the "instant on" case temperature.
NOTES:
1. This parameter is determned by device characterization but is not production
tested.
2. 3dV represents the interpolated capacitance when the input and output signals
switch from0V to 3V or from3V to 0V.
3. C
OUT
represents C
I/O
as well.
NOTE:
1. At Vcc
<
2.0V, input leakages are undefined.
Symbol
Rating
Commercial
& Industrial
Unit
V
TERM
(2)
Termnal Voltage
wth Respect
to GND
-0.5 to +7.0
V
T
BIAS
Temperature
Under Bias
-55 to +125
o
C
T
STG
Storage
Temperature
-65 to +150
o
C
I
OUT
DC Output
Current
50
mA
3739 tbl 05
Grade
Ambient
Temperature
GND
Vcc
Commercial
0
O
C to +70
O
C
0V
5.0V
+
10%
Industrial
-40
O
C to +85
O
C
0V
5.0V
+
10%
3739 tbl 06
Symbol
Parameter
Mn.
Typ.
Max.
Unit
V
CC
Supply Voltage
4.5
5.0
5.5
V
GND
Ground
0
0
0
V
V
IH
Input High Voltage
2.2
____
6.0
(2)
V
V
IL
Input Low Voltage
-0.5
(1)
____
0.8
V
3739 tbl 07
Symbol
Parameter
Conditions
(2)
Max.
Unit
C
IN
Input Capacitance
V
IN
= 3dV
9
pF
C
OUT
(3)
Output Capacitance
V
OUT
= 3dV
10
pF
3739 tbl 08
Symbol
Parameter
Test Conditions
707278S
707278L
Unit
Min.
Max.
Min.
Max.
|
LI
|
Input Leakage Current
(1)
V
CC
= 5.5V, V
IN
= 0V to V
CC
___
10
___
5
μA
|
LO
|
Output Leakage Current
CE
= V
IH
,
MBSEL
= V
IH
, V
OUT
= 0V to V
CC
___
10
___
5
μA
V
OL
Output Low Voltage
I
OL
= +4mA
___
0.4
___
0.4
V
V
OH
Output High Voltage
I
OH
= -4mA
2.4
___
2.4
___
V
3739 tbl 09
相關(guān)PDF資料
PDF描述
IDT707278 Dual Low-Noise JFET-Input General-Purpose Operational Amplifier 8-PDIP -40 to 85
IDT707278L Dual Low-Noise JFET-Input General-Purpose Operational Amplifier 8-PDIP -40 to 85
IDT707278L15PF Low-Noise JFET-Input Operational Amplifier 8-SOIC 0 to 70
IDT707278L15PFI Low-Noise JFET-Input Operational Amplifier 8-SOIC 0 to 70
IDT707278L20PF Low-Noise JFET-Input Operational Amplifier 8-SOIC 0 to 70
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT70824L20G 功能描述:IC SARAM 64KBIT 20NS 84PGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
IDT70824L20PF 功能描述:IC SARAM 64KBIT 20NS 80TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
IDT70824L20PF8 功能描述:IC SARAM 64KBIT 20NS 80TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
IDT70824L25G 功能描述:IC SARAM 64KBIT 25NS 84PGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ
IDT70824L25PF 功能描述:IC SARAM 64KBIT 25NS 80TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 產(chǎn)品變化通告:Product Discontinuation 26/Apr/2010 標準包裝:136 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步,DDR II 存儲容量:18M(1M x 18) 速度:200MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.9 V 工作溫度:0°C ~ 70°C 封裝/外殼:165-TBGA 供應(yīng)商設(shè)備封裝:165-CABGA(13x15) 包裝:托盤 其它名稱:71P71804S200BQ