參數(shù)資料
型號: IDT7164L30TP
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: DRAM
英文描述: 8347 PBGA NO-PB W/O ENCR
中文描述: 8K X 8 STANDARD SRAM, 30 ns, PDIP28
封裝: 0.300 INCH, PLASTIC, DIP-28
文件頁數(shù): 6/9頁
文件大?。?/td> 104K
代理商: IDT7164L30TP
6.1
6
IDT7164S/L
CMOS STATIC RAM 64K (8K x 8-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS (Continued)
(V
CC
= 5.0V
±
10%, All Temperature Ranges)
7164S35
7164L35
Min.
7164S45
(2)
7164L45
(2)
Min.
7164S55
(2)
7164L55
(2)
Min.
7164S70/85
(2)
7164L70/85
(2)
Min.
Symbol
Parameter
Max.
Max.
Max.
Max.
Unit
Read Cycle
t
RC
Read Cycle Time
35
45
55
70/85
ns
t
AA
t
ACS1(3)
t
ACS2(3)
t
CLZ1,2(4)
Chip Select-1, 2 to Output in Low-Z
Address Access Time
35
45
55
70/85
ns
Chip Select-1 Access Time
35
45
55
70/85
ns
Chip Select-2 Access Time
40
45
55
70/85
ns
5
5
5
5
ns
t
OE
t
OLZ(4)
t
CHZ1,2(4)
Chip Select-1, 2 to Output in High-Z
t
OHZ(4)
Output Disable to Output in High-Z
Output Enable to Output Valid
18
25
30
35/40
ns
Output Enable to Output in Low-Z
0
0
0
0
ns
15
20
25
30/35
ns
15
20
25
30/35
ns
t
OH
t
PU(4)
t
PD(4)
Output Hold from Address Change
5
5
5
5
ns
Chip Select to Power Up Time
0
0
0
0
ns
Chip Deselect to Power Down Time
35
45
55
70/85
ns
Write Cycle
t
WC
Write Cycle Time
35
45
55
70/85
ns
t
CW1, 2
Chip Select to End-of-Write
25
33
50
60/75
ns
t
AW
Address Valid to End-of-Write
25
33
50
60/75
ns
t
AS
Address Set-up Time
0
0
0
0
ns
t
WP
Write Pulse Width
Write Recovery Time
(
CS
1
,
WE
)
Write Recovery Time
(CS
2
)
25
25
50
60/75
ns
t
WR1
0
0
0
0
ns
t
WR2
t
WHZ(4)
5
5
5
5
ns
Write Enable to Output in High-Z
14
18
25
30/35
ns
t
DW
Data to Write Time Overlap
Data Hold from Write Time
(
CS
1
,
WE
)
Data Hold from Write Time
(CS
2
)
15
20
25
30/35
ns
t
DH1
0
0
0
0
ns
t
DH2
t
OW(4)
5
5
5
5
ns
Output Active from End-of-Write
4
4
4
4
ns
NOTES:
1. 0
°
to +70
°
C temperature range only.
2. –55
°
C to +125
°
C temperature range only. Also available: 100ns military devices.
3. Both chip selects must be active for the device to be selected.
4. This parameter is guaranteed by device characterization, but is not production tested.
2967 tbl 11
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