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| 型號： | IDT79RV4700200DPG |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 200 MHz, RISC PROCESSOR, PQFP208 |
| 封裝： | 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, QFP-208 |
| 文件頁數(shù)： | 24/25頁 |
| 文件大?。?/td> | 711K |
| 代理商： | IDT79RV4700200DPG |
8 of 25
April 10, 2001
IDT79R4700
Thermal Considerations
The RC4700 uses special packaging techniques to improve the
thermal properties of high-speed processors. The RC4700 is packaged
using cavity down packaging in a 179-pin PGA package, and a 208-lead
QFP package. These packages effectively dissipate the power of the
CPU, increasing device reliability.
The R4700 is guaranteed in a case temperature range of 0
° to +85°
C. The type of package, speed (power) of the device, and airflow condi-
tions affect the equivalent ambient temperature conditions that will meet
this specification.
The equivalent allowable ambient temperature, TA, can be calculated
using the thermal resistance from case to ambient (
CA) of the given
package. The following equation relates ambient and case tempera-
tures:
TA = TC - P *
CA
where P is the maximum power consumption at hot temperature,
calculated by using the maximum ICC specification for the device.
Typical values for
CA at various airflows are shown in Table 2:.
Revision History
January 1996: Initial draft.
March 1997: Deleted data on 150MHz speed for 5V part only.
August 1997: Upgraded 80 to 175 MHz speed specs from “Prelimi-
nary” to “Final.”
June 1999: Upgraded speed to 200MHz on 3V part specs. Package
change to DP.
June 29, 2000: Added back 175 and 200 MHz speeds.
April 10, 2001: In the Data Output category of the System Interface
Parameters tables, changed values in the Min column for all speeds
from 1.0 to 0.
CA
Airflow (ft/min)
0
200
400
600
800
1000
PGA
16
7
5
3
2.5
2
QFP
21
13
10
9
8
7
Table 2: Thermal Resistance (
CA) at Various Airflows
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