參數(shù)資料
型號(hào): IDT89HPES24NT3ZBBXG8
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 6/31頁(yè)
文件大小: 0K
描述: IC PCI SW 24LANE 3PORT 420-SBGA
標(biāo)準(zhǔn)包裝: 250
系列: PRECISE™
類(lèi)型: PCI Express 開(kāi)關(guān) - Gen1
應(yīng)用: 服務(wù)器,儲(chǔ)存,通信,嵌入式,消費(fèi)品
安裝類(lèi)型: 表面貼裝
封裝/外殼: 420-LBGA
供應(yīng)商設(shè)備封裝: 420-SBGA(27x27)
包裝: 帶卷 (TR)
其它名稱(chēng): 89HPES24NT3ZBBXG8
14 of 31
January 5, 2009
IDT 89HPES24NT3 Data Sheet
Recommended Operating Temperature
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 14.
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
All power measurements assume that the part is mounted on a 10 layer printed circuit board with 0 LFM airflow.
Thermal Considerations
This section describes thermal considerations for the PES24NT3 (27mm2 BXG420 package). The data in Table 15 below contains information that
is relevant to the thermal performance of the PES24NT3 switch.
Note: The parameter θJA(eff) is not the absolute thermal resistance for the package as defined by JEDEC (JESD-51). Because resistance
can vary with the number of board layers, size of the board, and airflow, θJA(eff) is the effective thermal resistance. The values for effective
θJA given above are based on a 10-layer, standard height, full length (4.3”x12.2”) PCIe add-in card.
Grade
Temperature
Commercial
0
°C to +70°C Ambient
Table 13 PES24NT3 Operating Temperatures
Number of
Connected Lanes:
Port-A/Port-B/Port-C
Core (Watts)
(1.0V supply)
PCIe Digital
(Watts)
(1.0V supply)
PCIe Analog
(Watts)
(1.0V supply)
PCIe Termin-
ation (Watts)
(1.5V supply)
I/O (Watts)
(3.3V supply)
Total (Watts)
Typ
Max
Typ
Max
Typ
Max
Typ
Max
Typ
Max
Typ
Max
8/4/4
0.59
0.84
0.75
1.08
0.33
0.42
0.62
0.78
0.002
0.01
2.3
3.12
8/8/8
0.68
0.95
0.98
1.43
0.38
0.48
0.88
1.01
0.002
0.01
2.92
3.88
Table 14 PES24NT3 Power Consumption
Symbol
Parameter
Value
Units
Conditions
TJ(max)
Junction Temperature
125
oCMaximum
TA(max)
Ambient Temperature
70
oC
Maximum for commercial-rated products
θJA(effective)
Effective Thermal Resistance, Junction-to-Ambient
10.6
oC/W
Zero air flow
8.5
oC/W
1 m/S air flow
7.6
oC/W
2 m/S air flow
θJB
Thermal Resistance, Junction-to-Board
6.8
oC/W
θJC
Thermal Resistance, Junction-to-Case
0.7
oC/W
P
Power Dissipation of the Device
3.88
Watts
Maximum
Table 15 Thermal Specifications for PES24NT3, 27x27mm BXG420 Package
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