參數(shù)資料
型號(hào): IR3088M
廠商: International Rectifier
英文描述: XPHASE PHASE IC WITH FAULT AND OVERTEMP DETECT
中文描述: XPHASE相集成電路及超溫故障檢測
文件頁數(shù): 32/34頁
文件大?。?/td> 688K
代理商: IR3088M
I
IR3088
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder
Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is completely
removed from between the lead lands forming a single opening for each “group” of lead lands.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of
0.17mm remains.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the
copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have
the solder resist opening for the land pad to be smaller than the part pad.
Ensure that the solder resist in-between the lead lands and the pad land is
0.15mm due to the high aspect
ratio of the solder resist strip separating the lead lands from the pad land.
The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
diameter of the via.
Page 32 of 34
9/30
/04
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