參數(shù)資料
型號: IR3088M
廠商: International Rectifier
英文描述: XPHASE PHASE IC WITH FAULT AND OVERTEMP DETECT
中文描述: XPHASE相集成電路及超溫故障檢測
文件頁數(shù): 33/34頁
文件大小: 688K
代理商: IR3088M
I
IR3088
Stencil Design
The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch
devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower; openings in
stencils < 0.25mm wide are difficult to maintain repeatable solder release.
The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
land.
The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately
50% area of solder on the center pad. If too much solder is deposited on the center pad the part will float
and the lead lands will be open.
The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening
minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands
when the part is pushed into the solder paste.
Metal and Solder Resist
Page 33 of 34
9/30
/04
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