參數(shù)資料
型號: IS45S32200C1-7TLA
廠商: INTEGRATED SILICON SOLUTION INC
元件分類: DRAM
英文描述: 512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
中文描述: 2M X 32 SYNCHRONOUS DRAM, 5.5 ns, PDSO86
封裝: 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-86
文件頁數(shù): 33/59頁
文件大小: 622K
代理商: IS45S32200C1-7TLA
IS45S32200C1
ISSI
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B
05/18/06
33
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Parameters
Rating
Unit
V
DD
MAX
V
DDQ
V
IN
V
OUT
P
D
MAX
I
CS
T
OPR
Maximum Supply Voltage
Maximum Supply Voltage for Output Buffer
Input Voltage
Output Voltage
Allowable Power Dissipation
Output Shorted Current
Operating Temperature
–1.0 to +4.6
–1.0 to +4.6
–1.0 to +4.6
–1.0 to +4.6
1
50
0 to +70
–40 to +85
–55 to +150
V
V
V
V
W
mA
°C
MAX
A:
A1:
T
STG
Storage Temperature
°C
DC RECOMMENDED OPERATING CONDITIONS
(2,5)
(
A1: T
A
= -40 to +85°C, A: T
A
= 0 to +70°C)
Symbol
Parameter
Min.
Typ.
Max.
Unit
V
DD
, V
DDQ
V
IH
V
IL
Supply Voltage
Input High Voltage
(3)
Input Low Voltage
(4)
3.0
2.0
-0.3
3.3
3.6
V
V
V
V
DD
+ 0.3
+0.8
CAPACITANCE CHARACTERISTICS
(1,2)
(At T
A
= 0 to +25°C, V
DD
= V
DDQ
= 3.3 ± 0.3V, f = 1 MHz)
Symbol
Parameter
Typ.
Max.
Unit
C
IN1
C
IN2
CI/O
Input Capacitance: A0-A10, BA0, BA1
Input Capacitance: (CLK, CKE,
CS
,
RAS
,
CAS
,
WE
, LDQM, UDQM)
Data Input/Output Capacitance: DQ0-DQ31
4
4
5
pF
pF
pF
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
2. All voltages are referenced to GND.
3. V
IH
(max) = V
DDQ
+ 2.0V with a pulse width
3 ns. The pluse width cannot be greater than one third of the cycle rate.
4. V
IL
(min) = GND – 2.0V with a pulse < 3 ns. The pluse width cannot be greater than one third of the cycle rate.
5. An initial pause of 100us is required after power up, followed by two AUTO REFRESH commands, before proper device operation
is ensured. (Vdd and VddQ must be powered up simultaneously. GND and GNDQ must be at same potential.) The two AUTO
REFRESH command wake-ups should be repeated anytime the t
REF
refresh requirement is exceeded.
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