15 FN7560.5 December 19, 2013 Package Outline Drawing L8.3x3H 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)" />
參數(shù)資料
型號: ISL33002MSOPEVAL1Z
廠商: Intersil
文件頁數(shù): 7/18頁
文件大?。?/td> 0K
描述: EVAL BOARD ISL33002 8MSOP
標準包裝: 1
主要目的: 電源管理,熱交換控制器
嵌入式:
已用 IC / 零件: ISL33002IUZ
主要屬性: 2 通道總線緩沖器
次要屬性: I²C 接口
已供物品:
相關(guān)產(chǎn)品: ISL33002IUZ-T-ND - IC BUS BUFF HOTSWAP 2WR 8MSOP
ISL33002IRTZ-T-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IRTZ-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IRT2Z-T-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IRT2Z-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IUZ-ND - IC BUS BUFF HOTSWAP 2WR 8MSOP
ISL33001, ISL33002, ISL33003
15
FN7560.5
December 19, 2013
Package Outline Drawing
L8.3x3H
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 0, 2/08
BOTTOM VIEW
TOP VIEW
SIDE VIEW
DETAIL “X”
TYPICAL RECOMMENDED LAND PATTERN
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optional, but must be
measured between 0.15mm and 0.30mm from the terminal tip.
Lead width dimension applies to the metallized terminal and is
Dimensions in (
) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.
1.
NOTES:
8
5
1
4
SEE DETAIL "X"
0 .80 MAX
( 6X 0 . 5 )
2 . 80
( 2.38 )
8X 0.60
SEATING PLANE
C
0.2 REF
0 . 05 MAX.
0 . 00 MIN.
C
0.08
BASE PLANE
C
0.10
C
PIN #1 INDEX AREA
6
(4X)
0.15
PIN 1
INDEX AREA
3.00
B
3.00
A
6
6 X 0.50
8 X 0.25
C
0.10 M
B
A
8 X 0.40
1.50 REF
( 1.64 )
2.38
1.64
2.20
( 8X 0.25 )
( 2 .20 )
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL33003 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability
ISL33003IRT2Z 功能描述:I2C 接口集成電路 VIS25 8 INCH I2C BUFFER 8LD IND RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
ISL33003IRT2Z-T 功能描述:I2C 接口集成電路 VIS25 8 INCH I2C BUFFER 8LD IND RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
ISL33003IRTZ 功能描述:I2C 接口集成電路 W/ANNEAL VIS25 8INCH I2C BUFR IND(-40 T RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
ISL33003IRTZ-T 功能描述:I2C 接口集成電路 W/ANNEAL VIS25 8INCH I2C BUFR IND(-40 T RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16