16 FN7560.5 December 19, 2013 Package Outline Drawing L8.3x3A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 4," />
參數(shù)資料
型號: ISL33002MSOPEVAL1Z
廠商: Intersil
文件頁數(shù): 8/18頁
文件大?。?/td> 0K
描述: EVAL BOARD ISL33002 8MSOP
標準包裝: 1
主要目的: 電源管理,熱交換控制器
嵌入式:
已用 IC / 零件: ISL33002IUZ
主要屬性: 2 通道總線緩沖器
次要屬性: I²C 接口
已供物品:
相關(guān)產(chǎn)品: ISL33002IUZ-T-ND - IC BUS BUFF HOTSWAP 2WR 8MSOP
ISL33002IRTZ-T-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IRTZ-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IRT2Z-T-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IRT2Z-ND - IC BUS BUFF HOTSWAP 2WR 8TDFN
ISL33002IUZ-ND - IC BUS BUFF HOTSWAP 2WR 8MSOP
ISL33001, ISL33002, ISL33003
16
FN7560.5
December 19, 2013
Package Outline Drawing
L8.3x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 4, 2/10
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optional, but must be
between 0.15mm and 0.20mm from the terminal tip.
Dimension applies to the metallized terminal and is measured
Dimensions in (
) for Reference Only.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.
1.
NOTES:
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
C
0 . 2 REF
0 . 05 MAX.
0 . 02 NOM.
5
3.00
A
B
3.
00
(4X)
0.15
6
PIN 1
INDEX AREA
PIN #1
6X 0.65
1.50 ±0.10
8
1
8X 0.30 ± 0.10
6
0.75 ±0.05
SEE DETAIL "X"
0.08
0.10
C
( 2.90 )
(1.50)
( 8 X 0.30)
( 8X 0.50)
( 2.30)
( 1.95)
2.30 ±0.10
0.10
8X 0.30 ±0.05
A
MC
B
4
2X 1.950
(6x 0.65)
INDEX AREA
PIN 1
Compliant to JEDEC MO-229 WEEC-2 except for the foot length.
7.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL33003 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability
ISL33003IRT2Z 功能描述:I2C 接口集成電路 VIS25 8 INCH I2C BUFFER 8LD IND RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
ISL33003IRT2Z-T 功能描述:I2C 接口集成電路 VIS25 8 INCH I2C BUFFER 8LD IND RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
ISL33003IRTZ 功能描述:I2C 接口集成電路 W/ANNEAL VIS25 8INCH I2C BUFR IND(-40 T RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16
ISL33003IRTZ-T 功能描述:I2C 接口集成電路 W/ANNEAL VIS25 8INCH I2C BUFR IND(-40 T RoHS:否 制造商:NXP Semiconductors 電源電壓-最大:5.5 V 電源電壓-最小:2.3 V 最大工作頻率:400 KHz 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-16