參數(shù)資料
型號: IXGH28N30A
廠商: IXYS CORP
元件分類: 功率晶體管
英文描述: HiPerFAST IGBT
中文描述: 56 A, 300 V, N-CHANNEL IGBT, TO-247AD
封裝: TO-247AD, 3 PIN
文件頁數(shù): 1/2頁
文件大小: 52K
代理商: IXGH28N30A
1 - 2
2000 IXYS All rights reserved
Features
International standard packages
JEDEC TO-247 SMD surface
mountable and JEDEC TO-247 AD
High current handling capability
Newest generation HDMOS
TM
process
MOS Gate turn-on
- drive simplicity
Applications
AC motor speed control
DC servo and robot drives
DC choppers
Uninterruptible power supplies (UPS)
Switched-mode and resonant-mode
power supplies
Advantages
High power density
Suitable for surface mounting
Switching speed for high frequency
applications
Easy to mount with 1 screw,
(isolated mounting screw hole)
97529A (9/98)
Symbol
Test Conditions
Characteristic Values
(T
J
= 25 C, unless otherwise specified)
min.
typ.
max.
BV
CES
V
GE(th)
I
C
I
C
= 250 A, V
GE
= 0 V
= 250 A, V
CE
= V
GE
300
2.5
V
V
5
I
CES
V
CE
= 0.8 V
CES
V
GE
= 0 V
T
J
= 25 C
T
J
= 125 C
200
A
1
mA
I
GES
V
CE
= 0 V, V
GE
= 20 V
100
nA
V
CE(sat)
I
C
= I
C90
, V
GE
= 15 V
1.85
2.1
V
HiPerFAST
TM
IGBT
Symbol
Test Conditions
Maximum Ratings
V
CES
V
CGR
V
GES
V
GEM
I
C25
I
C90
I
CM
SSOA
(RBSOA)
T
J
= 25 C to 150 C
T
J
= 25 C to 150 C; R
GE
= 1 M
Continuous
Transient
300
300
V
V
20
30
V
V
T
C
= 25 C
T
C
= 90 C
T
C
= 25 C, 1 ms
V
= 15 V, T
= 125 C, R
= 10
Clamped inductive load, L = 100 H
56
28
A
A
A
112
I
= 56
@ 0.8 V
CES
A
P
C
T
J
T
JM
T
stg
Maximum Lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum Tab temperature for soldering SMD devices for 10 s
T
C
= 25 C
150
W
-55 ... +150
C
C
C
150
-55 ... +150
300
C
260
C
M
d
Weight
Mounting torque (M3)
1.13/10 Nm/lb.in.
TO-247 AD
TO-268
6
4
g
g
Preliminary data
V
CES
I
C25
V
CE(sat)typ
=
t
fi(typ)
=
=
300
56
1.85 V
120 ns
V
A
=
IXGH 28N30A
IXGT 28N30A
TO-247 AD (IXGH)
GC
E
TO-268
(IXGT)
(TAB)
G
E
(TAB)
G = Gate,
E = Emitter,
C = Collector,
TAB = Collector
IXYS reserves the right to change limits, test conditions, and dimensions.
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