參數(shù)資料
型號: KAD5510P-50Q72
廠商: Intersil
文件頁數(shù): 19/29頁
文件大?。?/td> 0K
描述: IC ADC 10BIT 500MSPS SGL 72-QFN
產(chǎn)品培訓(xùn)模塊: High-Speed Analog-to-Digital Converters
標(biāo)準(zhǔn)包裝: 1
系列: FemtoCharge™
位數(shù): 10
采樣率(每秒): 500M
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 438mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 72-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 72-QFN(10x10)
包裝: 托盤
輸入數(shù)目和類型: 1 個差分,單極
26
FN6811.2
October 8, 2009
ADC Evaluation Platform
Layout Considerations
Split Ground and Power Planes
Data converters operating at high sampling frequencies require
extra care in PC board layout. Many complex board designs
benefit from isolating the analog and digital sections. Analog
supply and ground planes should be laid out under signal and
clock inputs. Locate the digital planes under outputs and logic
pins. Grounds should be joined under the chip.
Clock Input Considerations
Use matched transmission lines to the transformer inputs for
the analog input and clock signals. Locate transformers and
terminations as close to the chip as possible.
Exposed Paddle
The exposed paddle must be electrically connected to analog
ground (AVSS) and should be connected to a large copper
plane using numerous vias for optimal thermal performance.
Bypass and Filtering
Bulk capacitors should have low equivalent series
resistance. Tantalum is a good choice. For best
performance, keep ceramic bypass capacitors very close to
device pins. Longer traces will increase inductance, resulting
in diminished dynamic performance and accuracy. Make
sure that connections to ground are direct and low
impedance. Avoid forming ground loops.
LVDS Outputs
Output traces and connections must be designed for 50
Ω
(100
Ω differential) characteristic impedance. Keep traces
FIGURE 45. LVDS OUTPUTS
FIGURE 46. CMOS OUTPUTS
FIGURE 47. VCM_OUT OUTPUT
Equivalent Circuits (Continued)
D[9:0]P
OVDD
2mA OR
3mA
2mA OR
3mA
DATA
D[9:0]N
OVDD
D[9:0]
OVDD
DATA
VCM
AVDD
0.535V
+
KAD5510P-50
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