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參數(shù)資料
| 型號： | KMM965G112 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 1Mx64 SGRAM SODIMM(1Mx64 圖形RAM模塊) |
| 中文描述： | 1Mx64 SGRAM個SODIMM（1Mx64圖形內(nèi)存模塊） |
| 文件頁數(shù)： | 15/15頁 |
| 文件大?。?/td> | 150K |
| 代理商： | KMM965G112 |
SGRAM MODULE
KMM965G112Q(P)N / KMM966G112Q(P)N
ELECTRONICS
- 16
Rev. 2.2 (Jul. 1998)
Byte #
Function Described
Function Supported
Hex value
Note
-6
-7
-8
-10
-6
-7
-8
-10
35
Data signal Input hold time (=tSH)
1ns
1ns
1ns
1ns
10h
10h
10h
10h
2
36
Block Write Size
8 Columns
03h
37~61
Superset information (maybe used in future)
-
00h
62
SPD data revision code
Initial Release
00h
TBD
63
Checksum for bytes 0 ~ 62
-
22h
43h
66h
BDh
64
Manufacturer JEDEC ID code
Samsung
CEh
65~71
...... Manufacturer JEDEC ID code
Samsung
00h
72
Manufacturing location
Onyang Korea
01h
73
Manufacturer part # (Samsung memory)
K
4Bh
74
Manufacturer part # (Samsung memory)
M
4Dh
75
Manufacturer part # (Memory module)
M
4Dh
76
Manufacturer part # (Memory type & edge connector)
9
39h
77
Manufacturer part # (Data bits)
Blank
20h
78
...... Manufacturer part # (Data bits)
6
36h
79
...... Manufacturer part # (Data bits)
6
36h
80
Manufacturer part # (Mode & operating voltage)
G
47h
81
Manufacturer part #
Blank
20h
82
...... Manufacturer part #
1
31h
83
Manufacturer part #
1
31h
84
Manufacturer part #
2
32h
85
Manufacturer part # (Component revision)
Blank(M-Die)
20h
86
Manufacturer part # (Package type)
Q(PQFP) / P(TQFP)
51h / 50h
87
Manufacturer part # (PCB revision)
N
4Eh
88
Manufacturer part # (Hyphen)
" - "
2Dh
89
Manufacturer part # (Power)
G
47h
90
Manufacturer part # (Minimum cycle time)
6
7
8
0
36h
37h
38h
30h
91
Manufacturer revision code (For PCB)
N
4Eh
92
...... Manufacturer revision code (For component)
Blank(M-Die)
20h
93
Manufacturing date (Week)
-
-
3
94
Manufacturing date (Year)
-
-
3
95~98
Assembly serial #
-
-
4
99~12
Manufacturer specific data (may be used in future)
-
FFh
126
Reserved
-
FFh
127
Reserved
-
FFh
128+
Unused storage locations
-
FFh
1. The bank select address is excluded in counting the total # of addresses.
2. This value is based on the component specification.
3. These bytes are programmed by code of Date Week & Date Year with BCD format.
4. These bytes are programmed by Samsung
′
s own Assembly Serial # system. All modules may have different unique serial #.
Note :
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