參數(shù)資料
型號: KMPC8315EVRAGDA
廠商: Freescale Semiconductor
文件頁數(shù): 102/106頁
文件大小: 0K
描述: IC MPU POWERQUICC II 620-PBGA
標(biāo)準(zhǔn)包裝: 2
系列: MPC83xx
處理器類型: 32-位 MPC83xx PowerQUICC II Pro
速度: 400MHz
電壓: 1V
安裝類型: 表面貼裝
封裝/外殼: 620-BBGA 裸露焊盤
供應(yīng)商設(shè)備封裝: 620-PBGA(29x29)
包裝: 托盤
MPC8315E PowerQUICC II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
95
Thermal
25 Thermal
This section describes the thermal specifications of the MPC8315E.
25.1
Thermal Characteristics
This table provides the package thermal characteristics for the 620 29
29 mm TEPBGA II.
6
0010
0000101
66.67
133.33
333.33
7
0101
0000110
25
125
375
8
0100
0000110
33.33
133.33
400
9
0010
0000110
66.67
133.33
400
Table 78. Package Thermal Characteristics for TEPBGA II
Characteristic
Board type
Symbol
Value
Unit
Note
Junction to ambient natural convection
Single layer board (1s)
RJA
23
°C/W
1, 2
Junction to ambient natural convection
Four layer board (2s2p)
RJA
16
°C/W
1, 2, 3
Junction to ambient (@200 ft/min)
Single layer board (1s)
RJMA
18
°C/W
1, 3
Junction to ambient (@200 ft/min)
Four layer board (2s2p)
RJMA
13
°C/W
1, 3
Junction to board
RJB
8°C/W
4
Junction to case
RJC
6°C/W
5
Junction to package top
Natural convection
JT
6°C/W
6
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
Table 77. Suggested PLL Configurations
Conf. No.
SPMF
Core\PLL
Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz)
相關(guān)PDF資料
PDF描述
KMPC8315ECVRAGDA IC MPU POWERQUICC II 620-PBGA
KMPC8315CVRAGDA IC MPU POWERQUICC II 620-PBGA
KMPC8314EVRAGDA IC MPU POWERQUICC II 620-PBGA
KMPC8314ECVRAGDA IC MPU POWERQUICC II 620-PBGA
KMPC8314CVRAGDA IC MPU POWERQUICC II 620-PBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8315VRAGDA 功能描述:微處理器 - MPU NON-ENCRYPT RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8321CVRADDC 功能描述:微處理器 - MPU 8321 NOPB PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8321CVRAFDC 功能描述:微處理器 - MPU 8321 NOPB PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8321CZQADDC 功能描述:微處理器 - MPU 8321 PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8321CZQAFDC 功能描述:微處理器 - MPU 8321 PBGA W/O ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324