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參數(shù)資料
型號(hào)： KMPC8358EZQAGDGA
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 73/95頁(yè)
文件大小： 0K
描述： IC MPU POWERQUICC II 668-PBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC83xx
處理器類(lèi)型： 32-位 MPC83xx PowerQUICC II Pro
速度： 400MHz
電壓： 1.2V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 668-BBGA 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 668-PBGA-PGE（29x29）
包裝： 托盤(pán)
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
Freescale Semiconductor
75
Clocking
Note that lb_clk is not the external local bus or DDRC2 frequency; lb_clk passes through the a LB clock
divider to create the external local bus clock outputs (LSYNC_OUT and LCLK[0:2]). The LB clock
divider ratio is controlled by LCRR[CLKDIV].
In addition, some of the internal units may be required to be shut off or operate at lower frequency than
the csb_clk frequency. Those units have a default clock ratio that can be configured by a memory mapped
register after the device comes out of reset. Table 66 specifies which units have a configurable clock
frequency.
Table 67 provides the operating frequencies for the PBGA package under recommended operating
conditions (see Table 2). All frequency combinations shown in the table below may not be available.
Maximum operating frequencies depend on the part ordered, see Section 25.1, “Part Numbers Fully
Addressed by this Document,” for part ordering details and contact your Freescale sales representative or
authorized distributor for more information.
Table 66. Configurable Clock Units
Unit
Default
Frequency
Options
Security core
csb_clk/3
Off,
csb_clk1, csb_clk/2,
csb_clk/3
1 With limitation, only for slow csb_clk rates, up to 166 MHz.
PCI and DMA complex
csb_clk
Off,
csb_clk
Table 67. Operating Frequencies for the PBGA Package
Characteristic1
1 The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen such that the resulting csb_clk,
MCLK, LCLK[0:2], and
core_clk frequencies do not exceed their respective maximum or minimum operating frequencies.
400 MHz
Unit
e300 core frequency (
core_clk)
266–400
MHz
Coherent system bus frequency
(
csb_clk)
133–266
MHz
QUICC Engine frequency
(
ce_clk)
266–400
MHz
DDR and DDR2 memory bus frequency
(MCLK)2
2 The DDR data rate is 2x the DDR memory bus frequency.
100–133
MHz
Local bus frequency
(LCLK
n)3
3 The local bus frequency is 1/2, 1/4, or 1/8 of the lb_clk frequency (depending on LCRR[CLKDIV]) which is in turn 1x or 2x
the
csb_clk frequency (depending on RCWL[LBCM]).
16.67–133
MHz
PCI input frequency (CLKIN or PCI_CLK)
25–66.67
MHz
Security core maximum internal operating frequency
133
MHz
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參數(shù)描述
KMPC8358EZUAGDG 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8358EZUAGDGA 功能描述:微處理器 - MPU 8360 TBGA ENCRP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8358VRAGDDA 功能描述:微處理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8358VRAGDGA 功能描述:微處理器 - MPU 8358 PBGA NON-ENC NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8358VVAGDG 功能描述:微處理器 - MPU 8360 TBGA NOPB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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