參數(shù)資料
型號(hào): KMPC8555EVTALF
廠商: Freescale Semiconductor
文件頁數(shù): 8/88頁
文件大?。?/td> 0K
描述: IC MPU POWERQUICC III 783-FCPBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 667MHz
電壓: 1.2V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 4.2
16
Freescale Semiconductor
RESET Initialization
4.3
Real Time Clock Timing
Table 8 provides the real time clock (RTC) AC timing specifications.
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the MPC8555E. Table 9 provides the RESET initialization AC timing specifications.
Table 10 provides the PLL and DLL lock times.
Table 8. RTC AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
RTC clock high time
tRTCH
2 x
tCCB_CLK
——
ns
RTC clock low time
tRTCL
2 x
tCCB_CLK
——
ns
Table 9. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
μs—
Minimum assertion time for SRESET
512
SYSCLKs
1
PLL input setup time with stable SYSCLK before HRESET
negation
100
μs—
Input setup time for POR configs (other than PLL config) with
respect to negation of HRESET
4
SYSCLKs
1
Input hold time for POR configs (including PLL config) with
respect to negation of HRESET
2
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR
configs with respect to negation of HRESET
5
SYSCLKs
1
Notes:
1. SYSCLK is identical to the PCI_CLK signal and is the primary clock input for the MPC8555E. See the
MPC8555E
PowerQUICC III Integrated Communications Processor Reference Manual for more details.
Table 10. PLL and DLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
100
μs—
DLL lock times
7680
122,880
CCB Clocks
1, 2
Notes:
1. DLL lock times are a function of the ratio between the output clock and the platform (or CCB) clock. A 2:1 ratio results in the
minimum and an 8:1 ratio results in the maximum.
2. The CCB clock is determined by the SYSCLK
× platform PLL ratio.
相關(guān)PDF資料
PDF描述
HSC43DTEF CONN EDGECARD 86POS .100 EYELET
FMC49DRES-S93 CONN EDGECARD 98POS .100 EYELET
KMPC8555EPXAQF IC MPU POWERQUICC III 783-FCPBGA
FMC49DRES-S734 CONN EDGECARD 98POS .100 EYELET
FMC65DRAS CONN EDGECARD 130PS R/A .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KMPC8555EVTAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8555EVTAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555E RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8555PXALF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8555PXAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KMPC8555PXAQF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324