參數(shù)資料
型號(hào)： L6701TR
廠商： STMICROELECTRONICS
元件分類： 穩(wěn)壓器
英文描述： 1.5 A SWITCHING REGULATOR, 110 kHz SWITCHING FREQ-MAX, PDSO36
封裝： LEAD FREE, SSO-36
文件頁(yè)數(shù)： 42/44頁(yè)
文件大?。?/td> 627K
代理商： L6701TR
Obsolete
Product(s)
- Obsolete
Product(s)
L6701
2 Pins description and connection diagrams
7/44
19
REF_IN
Reference Input for the regulation.
Connect directly or through a resistor to the REF_OUT pin. See Section 10.3 for
details. This pin is used as input for the protections.
20
REF_OUT
Reference Output.
Connect directly or through a resistor to the REF_IN pin. See Section 10.3 for
details.
21 to 26
VID4
to
VID0, VID5
Voltage IDentification Pins.
Internally pulled up by 12.5A to 5V, connect to SGND to program a '0' or leave
floating to program a '1'. They allow programming output voltage as specified in
Table 5, Table 6 and Table 7 according to DAC_SEL status.
27
FBR
Remote Buffer Non Inverting Input.
Connect to the positive side of the load to perform remote sense.
See Section 16 for proper layout of this connection.
28
FBG
Remote Buffer Inverting Input.
Connect to the negative side of the load to perform remote sense.
See Section 16 for proper layout of this connection.
29 to 31
ISEN3
to
ISEN1
LS Current Sense Pins.
These pins are used for current balance phase-to-phase as well as for the
system OCP. Connect through a resistor RISEN to the relative PHASEx pin. See
Section 9 and Section 13.6 for details.
32
CS+
Droop Current Sense non-inverting input.
Connect through RPH-CPH network to the main inductors. Directly connect to
output voltage when Droop function is not required. See Section 10.1 and
Section 10.2 for details.
33
CS-
Droop Current Sense inverting input.
Connect through resistor RD to the main inductors common node. Leave floating
when Droop Function is not required. See Section 10.1 and Section 10.2 for
details.
This pin also monitors the output for any feedback disconnection. See
Section 13.4 for details.
34
VSEN
Remote Buffer Output. It manages OVP and UVP protections and PGOOD
(when applicable). See Section 13 for details.
35
FB
Error Amplifier Inverting Input. Connect with a resistor RFB vs. VSEN and with an
RF - CF toward COMP.
36
COMP
Error Amplifier Output. Connect with an RF - CF vs. FB.
The device cannot be disabled by pulling down this pin.
PAD
THERMAL
PAD
Thermal pad connects the Silicon substrate and makes good thermal contact
with the PCB to dissipate the power necessary to drive the external MOSFETs.
Connect to the PGND plane with several VIAs to improve thermal conductivity.
Table 1.
Pins description (continued)
Pin n
°
Name
Function
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