Figure 2-14. DCS Waveforms sysMEM Memory The LatticeECP/EC devices contain a number of sysMEM" />
參數(shù)資料
型號: LFEC3E-3TN100C
廠商: Lattice Semiconductor Corporation
文件頁數(shù): 57/163頁
文件大?。?/td> 0K
描述: IC FPGA 3.1KLUTS 67I/O 100-TQFP
標準包裝: 90
系列: EC
邏輯元件/單元數(shù): 3100
RAM 位總計: 56320
輸入/輸出數(shù): 67
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 100-LQFP
供應商設備封裝: 100-TQFP(14x14)
2-12
Architecture
LatticeECP/EC Family Data Sheet
Figure 2-14. DCS Waveforms
sysMEM Memory
The LatticeECP/EC devices contain a number of sysMEM Embedded Block RAM (EBR). The EBR consists of a 9-
Kbit RAM, with dedicated input and output registers.
sysMEM Memory Block
The sysMEM block can implement single port, dual port or pseudo dual port memories. Each block can be used in
a variety of depths and widths as shown in Table 2-6.
Table 2-6. sysMEM Block Configurations
Bus Size Matching
All of the multi-port memory modes support different widths on each of the ports. The RAM bits are mapped LSB
word 0 to MSB word 0, LSB word 1 to MSB word 1 and so on. Although the word size and number of words for
each port varies, this mapping scheme applies to each port.
RAM Initialization and ROM Operation
If desired, the contents of the RAM can be pre-loaded during device configuration. By preloading the RAM block
during the chip configuration cycle and disabling the write controls, the sysMEM block can also be utilized as a
ROM.
Memory Mode
Configurations
Single Port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
256 x 36
True Dual Port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
Pseudo Dual Port
8,192 x 1
4,096 x 2
2,048 x 4
1,024 x 9
512 x 18
256 x 36
CLK0
SEL
DCSOUT
CLK1
相關PDF資料
PDF描述
LFEC1E-5TN144C IC FPGA 1.5KLUTS 97I/O 144-TQFP
HCC65DRTF CONN EDGECARD 130PS DIP .100 SLD
FMC15DRYS CONN EDGECARD 30POS DIP .100 SLD
IR2166 IC PFC/BALLAST CONTROL 16-DIP
LFEC1E-3QN208I IC FPGA 1.5KLUTS 208PQFP
相關代理商/技術參數(shù)
參數(shù)描述
LFEC3E-3TN100I 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs 67 IO 1.2V -3 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-3TN144C 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs Pb-Free RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-3TN144I 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs 97 IO 1.2V -3 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-4F256C 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1K LUTs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
LFEC3E-4F256CES 功能描述:FPGA - 現(xiàn)場可編程門陣列 3.1 LUT 160 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256