參數(shù)資料
型號(hào): LFECP33E-4FN672I
廠商: Lattice Semiconductor Corporation
文件頁數(shù): 53/163頁
文件大小: 0K
描述: IC FPGA 32.8KLUTS 672FPBGA
產(chǎn)品培訓(xùn)模塊: LatticeECP3 Introduction
標(biāo)準(zhǔn)包裝: 40
系列: ECP
邏輯元件/單元數(shù): 32800
RAM 位總計(jì): 434176
輸入/輸出數(shù): 496
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 672-BBGA
供應(yīng)商設(shè)備封裝: 672-FPBGA(27x27)
4-80
Pinout Information
LatticeECP/EC Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
Thermal Management document
Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
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