參數(shù)資料
型號: LFX200B-04F256C
廠商: Lattice Semiconductor Corporation
文件頁數(shù): 22/119頁
文件大?。?/td> 0K
描述: IC FPGA 200K GATES 256-BGA
標(biāo)準(zhǔn)包裝: 90
系列: ispXPGA®
邏輯元件/單元數(shù): 2704
RAM 位總計: 113664
輸入/輸出數(shù): 160
門數(shù): 210000
電源電壓: 2.3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
Lattice Semiconductor
ispXPGA Family Data Sheet
114
For Further Information
In addition to this data sheet, the following Lattice technical notes may be helpful when designing with the ispXPGA
Family:
LFX500EC-04FN900C
476K
1.8
-4
Lead-Free fpBGA
900
LFX500EC-03FN900C
476K
1.8
-3
Lead-Free fpBGA
900
“E-Series” Industrial
Part Number
Gates
Voltage
Speed Grade
Package
Balls
LFX125EB-04FN256I
139K
2.5/3.3
-4
Lead-Free fpBGA
256
LFX125EB-03FN256I
139K
2.5/3.3
-3
Lead-Free fpBGA
256
LFX125EC-03FN256I
139K
1.8
-3
Lead-Free fpBGA
256
LFX200EB-04FN256I
210K
2.5/3.3
-4
Lead-Free fpBGA
256
LFX200EB-03FN256I
210K
2.5/3.3
-3
Lead-Free fpBGA
256
LFX200EC-03FN256I
210K
1.8
-3
Lead-Free fpBGA
256
LFX500EB-04FN900I
476K
2.5/3.3
-4
Lead-Free fpBGA
900
LFX500EB-03FN900I
476K
2.5/3.3
-3
Lead-Free fpBGA
900
LFX500EC-03FN900I
476K
1.8
-3
Lead-Free fpBGA
900
Revision History
Date
Version
Change Summary
Previous Lattice releases.
September 2003
07
Improved typical Icc data for LFX125B/C and LFX500B/C.
Improved external switching characteristics timing numbers for LFX125B/C.
Improved PIC timing numbers for LFX125B/C.
Improved tIOINDLY timing numbers for LFX125B/C.
Improved external switching characteristics timing numbers for LFX500B/C.
Improved PIC timing numbers for LFX500B/C.
Improved tIOINDLY timing numbers for LFX500B/C.
Enhanced CDR functionality description.
Logic Signal Connections and Signal Descriptions - removed CDRLOCK, LOSS and EXLOSS
descriptions.
January 2004
07.1
Added lead-free package designators.
June 2004
08.0
Updated CDR specifications and reference notes. Removed Source Synchronous (SS:No CAL)
mode references for the sysHSI blocks.
Revised Figures 16 and 24 for clarification.
Clarification of VCC sysHSI Block for 1.8V devices.
Updated IIL and IIH max specification.
Updated LVTTL and PCI 3.3 to support 5V tolerance.
“E-Series” Commercial (Cont.)
Part Number
Gates
Voltage
Speed Grade
Package
Balls
SELECT
DEVICES
DISCONTINUED
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LFX200B-04F516C 功能描述:FPGA - 現(xiàn)場可編程門陣列 210K 208 I/O ispJTAG RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FH516C 功能描述:FPGA - 現(xiàn)場可編程門陣列 Use LFX200B-04F516C RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FN256C 功能描述:FPGA - 現(xiàn)場可編程門陣列 210K Gt ispJTAG 2.5/ 3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FN516C 功能描述:FPGA - 現(xiàn)場可編程門陣列 210K Gt ispJTAG 2.5 /3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FN516C1 功能描述:FPGA - 現(xiàn)場可編程門陣列 RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256