參數(shù)資料
型號(hào): LFX200B-04F256C
廠商: Lattice Semiconductor Corporation
文件頁數(shù): 29/119頁
文件大小: 0K
描述: IC FPGA 200K GATES 256-BGA
標(biāo)準(zhǔn)包裝: 90
系列: ispXPGA®
邏輯元件/單元數(shù): 2704
RAM 位總計(jì): 113664
輸入/輸出數(shù): 160
門數(shù): 210000
電源電壓: 2.3 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 256-BGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
Lattice Semiconductor
ispXPGA Family Data Sheet
13
Figure 13. EBR Synchronous Read Timing Diagram
Synchronous Write: The WE signal controls the synchronous write operation. When the WE signal is high, the
write operation begins. Once the address and data are present and the Output Enable (OE) is active, a rising clock
edge (or falling edge depending on polarity) causes the data to be stored into the EBR. Figure 14 illustrates the
synchronous write timing.
Figure 14. EBR Synchronous Write Timing Diagram
Asynchronous Read: The WE signal controls the asynchronous read operation. When the WE signal is low, the
read operation begins. Shortly after the address is present, the stored data is available on the DATA port. Figure 15
illustrates the asynchronous read timing. For more information about the EBR, refer to TN1028 ispXPGA Memory
Figure 15. EBR Asynchronous Read Timing Diagram
WE
CLK
CE
DATA
ADDR
OE
Valid Data
Invalid Data
Valid Data
t
EBWEEN
t
EBADDS
t
EBCO
t
EBWES
t
EBCES
t
EBCPW
t
EBOEDIS
t
EBOEEN
t
EBCEH
t
EBWEH
t
EBWEDIS
t
EBADDH
WE
CLK
WRITE
DATA
ADDR
WRITE
t
EBWEH
t
EBADDS
t
EBADDH
t
EBDATAS
t
EBDATAH
t
EBPW
t
EBWES
WE
DATA
ADDR
OE
DATA1
Invalid Data
DATA1
ADDR0
ADDR1
ADDR2
DATA0
t
EBWEEN
t
EBARADO
t
EBOEDIS
t
EBOEEN
t
EBWEDIS
t
EBARAD_H
SELECT
DEVICES
DISCONTINUED
相關(guān)PDF資料
PDF描述
LFX200B-04FN256C IC FPGA 210KGATES 256FPBGA
RF803E IC ENCODER 3 DGTL I/O 8-PDIP
DS9100-B+ CONTACT TOUCH AND HOLD
LFEC33E-4FN484I IC FPGA 32.8KLUTS 484FPBGA
LFEC33E-5FN484C IC FPGA 32.8KLUTS 484FPBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFX200B-04F516C 功能描述:FPGA - 現(xiàn)場可編程門陣列 210K 208 I/O ispJTAG RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FH516C 功能描述:FPGA - 現(xiàn)場可編程門陣列 Use LFX200B-04F516C RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FN256C 功能描述:FPGA - 現(xiàn)場可編程門陣列 210K Gt ispJTAG 2.5/ 3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FN516C 功能描述:FPGA - 現(xiàn)場可編程門陣列 210K Gt ispJTAG 2.5 /3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX200B-04FN516C1 功能描述:FPGA - 現(xiàn)場可編程門陣列 RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256