參數(shù)資料
型號(hào)： LM75AD
廠商： NXP Semiconductors N.V.
元件分類： 工業(yè)控制
英文描述： Digital temperature sensor and thermal watchdog
封裝： LM75AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 17, 2005,;LM75AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 17, 2005,;LM
文件頁(yè)數(shù)： 19/24頁(yè)
文件大?。?/td> 137K
代理商： LM75AD
LM75A_4
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 10 July 2007
19 of 24
NXP Semiconductors
LM75A
Digital temperature sensor and thermal watchdog
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LM75AD,112 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
LM75AD,118 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
LM75AD.112 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital temperature sensor and thermal watchdog
LM75AD/G-T 功能描述:IC I2C TEMP SNSR/WATCHDOG 8-SOIC RoHS:是 類別:集成電路 (IC) >> PMIC - 熱管理 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 功能:溫度監(jiān)控系統(tǒng)（傳感器） 傳感器類型:內(nèi)部和外部 感應(yīng)溫度:-40°C ~ 125°C，外部傳感器 精確度:±2.5°C 本地（最大值），±5°C 遠(yuǎn)程（最大值） 拓?fù)?ADC，比較器，寄存器庫(kù) 輸出類型:2 線 SMBus? 輸出警報(bào):無(wú) 輸出風(fēng)扇:無(wú) 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-8 供應(yīng)商設(shè)備封裝:SOT-23-8 包裝:Digi-Reel® 其它名稱:296-22675-6
LM75AD112 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
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