參數(shù)資料
型號(hào): LPC2388FBD144
廠商: NXP Semiconductors N.V.
元件分類: 數(shù)學(xué)處理器
英文描述: Single-chip 16-bit-32-bit micro; 512 kB flash with ISP-IAP, Ethernet, USB 2.0 device-host-OTG, CAN, and 10-bit ADC-DAC
封裝: LPC2388FBD144<SOT486-1 (LQFP144)|<<http://www.nxp.com/packages/SOT486-1.html<1<Always Pb-free,;
文件頁數(shù): 68/72頁
文件大?。?/td> 1469K
代理商: LPC2388FBD144
LPC2388
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 13 July 2010
68 of 72
NXP Semiconductors
LPC2388
Single-chip 16-bit/32-bit microcontroller
17. Revision history
Table 19.
Document ID
LPC2388 v.2
Modifications:
Revision history
Release date
20100713
Table 3 “Pin description”
: added
Table note 9
for XTAL1 and XTAL2 pins
Table 3 “Pin description”
: added
Table note 10
for RTCX1 and RTCX2 pins
Table 4 “Limiting values”
: changed V
ESD
min/max to
2500/+2500
Table 6 “Static characteristics”
: removed R
pu
Table 6 “Static characteristics”
,
Table note 13
: changed value from 18 to 33
Table 6 “Static characteristics”
, added
Table note 3
Table 6 “Static characteristics”
: updated min, typical and max values for oscillator pins
Table 6 “Static characteristics”
: updated conditions and typical values for I
DD(DCDC)pd(3V3)
,
I
BATact
; added I
DD(DCDC)dpd(3V3)
and I
BAT
Added
Table 11 “Dynamic characteristics of flash”
Table 12 “Dynamic characteristics: Static external memory interface”
: updated table
Added
Table 14 “DAC electrical characteristics”
Section 7.2 “On-chip flash programming memory”
: removed text regarding flash endurance
minimum specs
Added
Section 7.25.4.4 “Deep power-down mode”
Section 7.26.2 “Brownout detection”
: changed V
DD(3V3)
to V
DD(DCDC)(3V3)
Added
Section 9 “Thermal characteristics”
Added
Section 10.1 “Power-down mode”
Added
Section 10.2 “Deep power-down mode”
Added
Section 10.3 “Electrical pin characteristics”
Added
Section 14.2 “Crystal oscillator XTAL input and component selection”
Added
Section 14.3 “RTC 32 kHz oscillator component selection”
Added
Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”
Added
Section 14.5 “Standard I/O pin configuration”
Added
Section 14.6 “Reset pin configuration”
Moved
Figure 12 “External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)”
to
below
Table 7 “Dynamic characteristics”
Updated
Figure 13 “External memory read access”
Updated
Figure 14 “External memory write access”
Updated
Figure 17 “ADC characteristics”
20081219
Product data sheet
Data sheet status
Product data sheet
Change notice
-
Supersedes
LPC2388 v.1
LPC2388 v.1
-
-
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