參數(shù)資料
型號(hào): LT3024EDE
廠商: LINEAR TECHNOLOGY CORP
元件分類(lèi): 基準(zhǔn)電壓源/電流源
英文描述: Dual 100mA/500mA Low Dropout, Low Noise, Micropower Regulator
中文描述: DUAL OUTPUT, ADJUSTABLE POSITIVE LDO REGULATOR, PDSO12
封裝: 4 X 3 MM, 0.75 MM HEIGHT, PLASTIC, MO-229WGED, DFN-12
文件頁(yè)數(shù): 15/16頁(yè)
文件大?。?/td> 493K
代理商: LT3024EDE
15
LT3024
3024f
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BB
Figure 7. Reverse Output Current
OUTPUT VOLTAGE (V)
100
90
80
760
60
50
40
30
20
10
0
R
μ
A
3024 F07
0
1
2
3
4
5
6
7
8
9
10
T
A
= 25
°
C
V
IN
= 0V
V
= V
CURRENT FLOWS
INTO OUTPUT PIN
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled to
ground, pulled to some intermediate voltage or is left open
circuit. Current flow back into the output will follow the
curve shown in Figure 7.
When the IN pin of the LT3024 is forced below either OUT
pin or either OUT pin is pulled above the IN pin, input current
for the corresponding regulator will typically drop to less
than 2
μ
A. This can happen if the input of the device is
connected to a discharged (low voltage) battery and the out-
put is held up by either a backup battery or a second regu-
lator circuit. The state of the SHDN1/SHDN2 pin will have
no effect on the reverse output current when the output is
pulled above the input.
APPLICATIO
S I
FOR
ATIO
U
W
U
U
FE16 (BB) TSSOP 0203
0.09 – 0.20
(.0036 – .0079)
0
°
– 8
°
0.45 – 0.75
(.018 – .030)
4.30 – 4.50*
(.169 – .177)
6.40
BSC
1
3
4
5
6
7
8
10
9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
2
RECOMMENDED SOLDER PAD LAYOUT
0.45
±
0.05
0.65 BSC
4.50
±
0.10
6.60
±
0.10
1.05
±
0.10
2.94
(.116)
3.58
(.141)
3.58
(.141)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
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