參數(shù)資料
型號: LT6402IUD-12#PBF
廠商: Linear Technology
文件頁數(shù): 7/16頁
文件大?。?/td> 0K
描述: IC DIFF AMP/ADC DRVR 16-QFN
標(biāo)準(zhǔn)包裝: 121
放大器類型: 差分
電路數(shù): 2
輸出類型: 差分
轉(zhuǎn)換速率: 400 V/µs
-3db帶寬: 300MHz
電流 - 輸入偏壓: 5µA
電壓 - 輸入偏移: 1000µV
電流 - 電源: 30mA
電流 - 輸出 / 通道: 35mA
電壓 - 電源,單路/雙路(±): 4 V ~ 5.5 V,±2 V ~ 2.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN-EP(3x3)
包裝: 管件
產(chǎn)品目錄頁面: 1322 (CN2011-ZH PDF)
15
640212fa
LT6402-12
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45 ± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
0.70 ±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
PACKAGE DESCRIPTION
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