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參數(shù)資料
| 型號： | LTC1955EUH#TR |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 8/22頁 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD INTERFC DUAL 32QFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 控制器類型： | 智能卡接口 |
| 接口： | 4 線串行 |
| 電源電壓： | 1.7 V ~ 5.5 V |
| 電流 - 電源： | 10µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN 裸露焊盤（5x5） |
| 包裝： | 帶卷 (TR) |
LTC1955
16
1955fd
For more information www.linear.com/LTC1955
Using S.A.M. Cards
For applications using one or more installed S.A.M.
cards, the PRES A/PRES B pins for those sockets must
be grounded before operation of the card can occur
(assuming NC/NO is grounded). The PRES A/PRES B
pull-up current is designed for very low consumption,
but ultralow current can be achieved in shutdown by us-
ing a microcontroller output to pull down on the PRES
A/PRES B pins only when communication is necessary.
The fault detection circuitry will not allow a card socket
to be operated unless a card is detected.
Asynchronous Channel A Card Detection
Since the shift register is transparent when LD is held
low, DOUT is the same as D15. Recall from Table 1 that
D15 indicates the status of the card detection channel for
channel A. Thus, it is not necessary to perform an entire
read/write operation to determine the card detection
status of channel A. With LD low, DOUT can be used to
generate a real time card detection interrupt. This could be
useful for one S.A.M. card, one smart card application.
Inter Card Communication
Communication is possible directly from one card socket
to the other when both cards are selected at the same
time. This can be achieved by the following sequence of
actions.
1. Start with both cards off and deselected
2. Activate the supply of the slave card
3. Select the slave card only
4. Initiate a reset on the slave card
5. Deselect the slave card
6. Activate the supply of the master card
7. Select the master card only
8. Initiate a reset on the master card
9. Select both cards
Using the UNDERV Pin
The UNDERV pin can be used to add protection against a
supplyundervoltagefault.Byusingtwoexternalprogram-
mingresistors,theundervoltagedetectioncanbesettoan
arbitrary level (Figure 7). To ensure that the smart cards
are properly shut down, there must be sufficient energy
available in the input bypass capacitor to run one or both
smart cards until the deactivation cycle begins. It can take
approximately 30s from the detection of a fault until the
deactivation sequence begins. It is desirable to maintain
the VBATT supply at 2.7V or greater during this period.
Consider the following (worst-case) example:
1. The UNDERV pin is programmed to trip below 3.1V.
2. It is possible to have both cards activated at 5V and
drawing 60mA.
Since the output voltage is programmed to 5V, the charge
pump will be acting as a voltage doubler. With two cards
drawing 60mA each, the input current will be 2 (60mA
+ 60mA), or about 240mA. Allowing the VBATT supply to
droop from 3.1V to 2.7V during the 30s timeout period,
the input capacitance would need to be at least:
240mA / [(3.1V – 2.7V) / 30s] or 18F.
Thermal Management
To minimize power dissipation, the LTC1955 will actively
decide whether to step up or down depending on the
required output voltages and available input voltage.
However, for optimum efficiency, the LTC1955 should be
powered from a 3.3V supply.
If the input voltage is above 3.6V, and both cards are
drawingmaximumcurrent,therecanbesubstantialpower
dissipation in the LTC1955. If the junction temperature in-
creasesaboveapproximately150°C,thethermalshutdown
circuitry will automatically deactivate both channels. To
reducethemaximumjunctiontemperature,agoodthermal
connection to the PC board is recommended.
Zero Shutdown Current
Although the LTC1955 is designed to have very low shut-
down current, it can still draw over a microampere on both
applicaTions inForMaTion
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| LTC1955IUH#PBF | 功能描述:IC SMART CARD INTERFACE DL 32QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:2,450 系列:- 控制器類型:SPI 總線至 I²C 總線橋接 接口:I²C，串行，SPI 電源電壓:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-HVQFN（4x4） 包裝:托盤 配用:568-3511-ND - DEMO BOARD SPI TO I2C 其它名稱:935286452157SC18IS600IBSSC18IS600IBS-ND |
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