參數(shù)資料
型號(hào): LTC2205CUK-14#TRPBF
廠商: Linear Technology
文件頁數(shù): 16/28頁
文件大?。?/td> 0K
描述: IC ADC 14-BIT 65MSPS 48-QFN
標(biāo)準(zhǔn)包裝: 2,000
位數(shù): 14
采樣率(每秒): 65M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 776mW
電壓電源: 單電源
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 48-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 48-QFN-EP(7x7)
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個(gè)差分
配用: DC890B-ND - BOARD USB DATA COLLECTION
LTC2205-14
23
220514fb
APPLICATIONS INFORMATION
Grounding and Bypassing
The LTC2205-14 requires a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2205-14 has been optimized for a owthrough layout
so that the interaction between inputs and digital outputs
is minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated as
much as possible. In particular, care should be taken not
to run any digital track alongside an analog signal track
or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, VCM, and OVDD pins. Bypass capacitors must
be located as close to the pins as possible. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2205-14 differential inputs should run parallel
and close to each other. The input traces should be as
short as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2205-14 is transferred
from the die through the bottom-side exposed pad. For
good electrical and thermal performance, the exposed
pad must be soldered to a large grounded pad on the PC
board. It is critical that the exposed pad and all ground
pins are connected to a ground plane of sufcient area
with as many vias as possible.
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